66AK2H12BAAWA2

66AK2H12BAAWA2

$539.84
  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:1a57c662d89e Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:chipapexlimited@gmail.com
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

*
*
*
*
Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:12.75MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

Download product information

66AK2H12BAAWA2

Buying Guide
Summary

Texas Instruments 66AK2H12BAAWA2 is used in DSP (Digital Signal Processors) category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC DSP ARM SOC 1517FCBGA), Temperature (-40°C ~ 100°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H12BAAWA2, confirm Clock Rate (1.2GHz) is suitable for your use case and operating conditions.
  • Double-check the mounting type (Surface Mount) for your intended installation method.
  • Double-check the data interface (EBI/EMI, Ethernet, DMA, etc.) for integration and verification planning.
Alternates & Substitutions
  • For DSP (Digital Signal Processors), treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Begin with the constraints that are hardest to change later: package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount.
  • For digital parts, align interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and validate firmware/boot and signal integrity assumptions before production.
  • If substitutions are likely, write down the non-negotiables and re-check them when the supply chain changes, not after field failures.
FAQ

What Supplier Device Package does 66AK2H12BAAWA2 have?
1517-FCBGA (40x40)

What Voltage - Core is listed for 66AK2H12BAAWA2?
Variable

Which Interface is listed for 66AK2H12BAAWA2?
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0

What packaging is listed for 66AK2H12BAAWA2?
Tray

Application Scenarios

When sourcing Texas Instruments 66AK2H12BAAWA2 for DSP (Digital Signal Processors), engineers typically focus on de-risking integration and keeping validation repeatable. In real deployments, selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Across production builds, the emphasis shifts to repeatable testing, predictable failure modes, and stable behavior across lots. For systems shipped at volume, predictable behavior is what keeps yield and field performance stable.

Compatibility Advice
  • In qualification work, confirm memory interface timing and SI assumptions so firmware behavior stays stable across temperature and lot variation. This avoids one-off tuning in production.
  • Before committing to volume builds, verify clocking and startup behavior so the system does not enter undefined states during cold start and power cycling. This avoids one-off tuning in production.
  • Before release to production, confirm boot mode, strapping, and reset sequencing so bring-up is deterministic across assembly variance. This keeps integration from depending on typical-only conditions.
Project Fit
  • Most suitable when you can verify Texas Instruments 66AK2H12BAAWA2 for DSP (Digital Signal Processors) integration across temperature and supply corners, typically when you can control power sequencing and decoupling so brownouts and erratic resets are avoided.
66AK2H12BAAWA266AK2H12BAAWA2
$539.84
Buy Now