66AK2H12BAAWA24

66AK2H12BAAWA24

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:641d572040db Category: Brand:

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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz DSP, 1.4GHz ARM®
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:12.75MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H12BAAWA24

Buying Guide
Summary

Texas Instruments 66AK2H12BAAWA24 is used in DSP (Digital Signal Processors) category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC DSP ARM SOC 1517FCBGA), Temperature (-40°C ~ 100°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H12BAAWA24, verify the data interface (EBI/EMI, Ethernet, DMA, etc.) and timing requirements for your system.
  • Confirm the operating temperature range (-40°C ~ 100°C (TC)) meets your deployment conditions.
  • Double-check Voltage - I/O (0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V) against your specification and operating conditions.
Alternates & Substitutions
  • In DSP (Digital Signal Processors), confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Then confirm the operating envelope (temperature -40°C ~ 100°C (TC)) with margin for transients and derating.
  • Start with mechanical equivalence and keep package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount aligned so the alternate is footprint-safe.
  • For digital parts, align interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and validate firmware/boot and signal integrity assumptions before production.
FAQ

Who is the manufacturer of 66AK2H12BAAWA24?
Texas Instruments

What are common selection points for a microcontroller like 66AK2H12BAAWA24?
Check flash/RAM headroom, peripheral set, connectivity options, package constraints, and availability for your production horizon.

Which Clock Rate is specified for 66AK2H12BAAWA24?
1.2GHz DSP, 1.4GHz ARM®

Which On-Chip RAM is specified for 66AK2H12BAAWA24?
12.75MB

Application Scenarios

In practice, when sourcing Texas Instruments 66AK2H12BAAWA24 for DSP (Digital Signal Processors), engineers typically focus on de-risking integration and keeping validation repeatable. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In practice, they execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Within consumer electronics, integration reduces BOM and speeds product iterations while maintaining stable user experience. In real deployments, across medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Across building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. This is why the following scenarios matter: they reflect the environmental and integration stresses that dominate outcomes. From an engineering workflow standpoint, this is where bench validation and field constraints meet.

Compatibility Advice
  • For second-source planning, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds. This keeps integration from depending on typical-only conditions.
Project Fit
  • Ideal when you can verify Texas Instruments 66AK2H12BAAWA24 for DSP (Digital Signal Processors) integration across temperature and supply corners, especially if you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
  • A practical check is to define acceptance criteria and validate the key assumptions across temperature and supply corners before approving substitutions.
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