66AK2H12BXAAW2

66AK2H12BXAAW2

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:40b73520f8c9 Category: Brand:

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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:12.75MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H12BXAAW2

Buying Guide
Summary

Texas Instruments 66AK2H12BXAAW2 is used in DSP (Digital Signal Processors) category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC DSP ARM SOC 1517FCBGA), Temperature (0°C ~ 85°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H12BXAAW2, confirm the data interface (EBI/EMI, Ethernet, DMA, etc.) matches your host interface and timing requirements.
  • Validate the operating temperature range (0°C ~ 85°C (TC)) for your environment and margin.
  • Confirm Voltage - I/O (0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V) is suitable for your use case and operating conditions.
Alternates & Substitutions
  • For DSP (Digital Signal Processors), compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Check that temperature 0°C ~ 85°C (TC) matches your system, then validate at corners instead of relying on typical values.
  • Treat package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount as the first filter, then move on to electrical and performance checks.
  • For MCU/memory substitutions, match interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and verify pin-mux, timing margins, and power sequencing.
FAQ

Who is the manufacturer of 66AK2H12BXAAW2?
Texas Instruments

Can you confirm the Voltage - I/O for 66AK2H12BXAAW2?
0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V

What On-Chip RAM is listed for 66AK2H12BXAAW2?
12.75MB

What Clock Rate is listed for 66AK2H12BXAAW2?
1.2GHz

Application Scenarios

In the DSP (Digital Signal Processors) category, Texas Instruments 66AK2H12BXAAW2 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Within automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. Within medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Early targeted testing tends to expose true integration risks before a design is scaled to production. When the constraints are clear, validation effort is more efficient and results are easier to compare across builds.

Compatibility Advice
  • For production stability, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds and temperature and supply corners.
Project Fit
  • Good fit when you can measure and verify Texas Instruments 66AK2H12BXAAW2 for DSP (Digital Signal Processors) integration with production-like fixtures, and you can provision programming and debug access so production test and field recovery are practical.
  • Poor fit when power-domain and decoupling constraints cannot be validated, increasing erratic reset risk, because the integration depends on constraints that cannot be controlled across builds.
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