73M1916-IVT/F

73M1916-IVT/F

  • Description:IC TELECOM INTERFACE 20TSSOP
  • Series:MicroDAA™

SKU:bc6f7c465540 Category: Brand:

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Product Detailed Parameters

  • Description:IC TELECOM INTERFACE 20TSSOP
  • Series:MicroDAA™
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tube
  • Function:Data Access Arrangement (DAA)
  • Interface:PCM, SPI
  • Number of Circuits:1
  • Voltage - Supply:3V ~ 3.6V
  • Current - Supply:-
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package:20-TSSOP
  • Power (Watts):-

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73M1916-IVT/F

Buying Guide
Summary

Analog Devices Inc./Maxim Integrated 73M1916-IVT-F is an electronic component in Telecom category. Key specs: description: IC TELECOM INTERFACE 20TSSOP; series: MicroDAA™; packaging: Tube; supply: 3V ~ 3.6V; temperature: -40°C ~ 85°C; package/case: 20-TSSOP (0.173", 4.40mm Width); mounting: Surface Mount; circuits: 1.

Selection Notes
  • For 73M1916-IVT-F, confirm package/case 20-TSSOP (0.173", 4.40mm Width), mounting Surface Mount to ensure footprint compatibility.
  • For 73M1916-IVT-F, validate the operating temperature range (-40°C ~ 85°C) against your environment.
  • For 73M1916-IVT-F, check the supply voltage requirement (3V ~ 3.6V) and any rail tolerance constraints.
FAQ

What should I provide for an accurate quote for 73M1916-IVT-F?
Send the part number (73M1916-IVT-F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 73M1916-IVT-F?
Analog Devices Inc./Maxim Integrated

What is the package/case of 73M1916-IVT-F?
20-TSSOP (0.173", 4.40mm Width)

What is the mounting type of 73M1916-IVT-F?
Surface Mount

Application Scenarios
In the Telecom category, Analog Devices Inc./Maxim Integrated 73M1916-IVT-F is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. Their specifications directly influence link budget, sensitivity, selectivity, and emission margins in crowded spectrum environments. Good RF building blocks accelerate certification and reduce re-spin risk in antenna-to-baseband designs. In handheld devices, compact RF building blocks reduce layout risk and speed compliance testing for emissions and susceptibility. In asset tracking, RFID elements must work near metal and liquids, so antenna and front-end choices determine real read range. In private LTE/5G and Wi-Fi infrastructure, RF stages operate in outdoor units exposed to humidity and thermal stress where stability affects throughput. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
73M1916-IVT/F73M1916-IVT/F

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