73S8023C-IMR/F

73S8023C-IMR/F

  • Description:IC INTERFACE SPECIALIZED 32QFN
  • Series:-

SKU:96e6e49f7e64 Category: Brand:

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Product Detailed Parameters

  • Description:IC INTERFACE SPECIALIZED 32QFN
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tape & Reel (TR)
  • Applications:Set-Top Boxes
  • Interface:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Package / Case:32-VFQFN Exposed Pad
  • Supplier Device Package:32-QFN (5x5)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount

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73S8023C-IMR/F

Buying Guide
Summary

Analog Devices Inc./Maxim Integrated 73S8023C-IMR-F is an electronic component in Specialized category. Key specs: description: IC INTERFACE SPECIALIZED 32QFN; packaging: Tape & Reel (TR); supply: 2.7V ~ 3.6V; package/case: 32-VFQFN Exposed Pad; mounting: Surface Mount.

Selection Notes
  • For 73S8023C-IMR-F, confirm package/case 32-VFQFN Exposed Pad, mounting Surface Mount to ensure footprint compatibility.
  • For 73S8023C-IMR-F, check the supply voltage requirement (2.7V ~ 3.6V) and any rail tolerance constraints.
  • For 73S8023C-IMR-F, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (packaging Tape & Reel (TR); supply 2.7V ~ 3.6V).
FAQ

How can I request a quote for 73S8023C-IMR-F?
Send the part number (73S8023C-IMR-F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 73S8023C-IMR-F?
Analog Devices Inc./Maxim Integrated

What is the packaging of 73S8023C-IMR-F?
Tape & Reel (TR)

What is the package/case of 73S8023C-IMR-F?
32-VFQFN Exposed Pad

Application Scenarios
Analog Devices Inc./Maxim Integrated 73S8023C-IMR-F is listed under the Specialized category and is commonly used when correctness, reliability, and qualification repeatability matter. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. In networking hardware, specialized parts reduce re-spin risk by providing proven behavior in dense racks. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it simplifies bring-up and troubleshooting by making the design easier to validate and support in production.
73S8023C-IMR/F73S8023C-IMR/F

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