911R5M-BSP3

911R5M-BSP3

  • Description:CAP SILICON 1.5PF 20% 100V DIE
  • Series:91
  • Mfr:MACOM Technology Solutions
  • Package:Bulk

SKU:9d5dd68c889d Category: Brand:

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Product Detailed Parameters

  • Description:CAP SILICON 1.5PF 20% 100V DIE
  • Series:91
  • Mfr:MACOM Technology Solutions
  • Package:Bulk
  • Capacitance:1.5 pF
  • Tolerance:±20%
  • Voltage - Breakdown:100 V
  • ESL (Equivalent Series Inductance):-
  • Applications:-
  • Features:High Reliability
  • Operating Temperature:-55°C ~ 150°C
  • Package / Case:Die
  • Height:-
  • Size / Dimension:-
  • ESR (Equivalent Series Resistance):-

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911R5M-BSP3

Buying Guide
Summary

MACOM Technology Solutions 911R5M-BSP3 is used in Silicon Capacitors category where derating, temperature behavior, and mechanical fit affect long-term stability. Key specs include Description (CAP SILICON 1.5PF 20% 100V DIE), Capacitance (1.5 pF), Tolerance (±20%), Temperature (-55°C ~ 150°C), and Package/case (Die).

Selection Notes
  • For 911R5M-BSP3, confirm Voltage - Breakdown (100 V) is suitable for your use case and operating conditions.
  • Confirm the package/case (Die) and any exposed-pad requirements for your assembly process.
  • Check the capacitance (1.5 pF) and tolerance against your design limits.
Alternates & Substitutions
  • For Silicon Capacitors, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • For substitutions, match the footprint-related items first: package/case Die, packaging Bulk.
  • For capacitor substitutions, match capacitance 1.5 pF, tolerance ±20% and confirm DC-bias/temperature effects if applicable.
  • Always compare the datasheet test conditions behind key specs (load, frequency, temperature) to avoid swapping in a part that was characterized differently.
FAQ

What is the Tolerance of 911R5M-BSP3?
±20%

Which Features is specified for 911R5M-BSP3?
High Reliability

What package type does 911R5M-BSP3 come in?
Die

Which Voltage - Breakdown is specified for 911R5M-BSP3?
100 V

Application Scenarios

For many Silicon Capacitors designs, MACOM Technology Solutions 911R5M-BSP3 is vetted against electrical margins, thermal headroom, and mechanical integration before the BOM is frozen. Selection depends on ESR/ESL, ripple current, temperature behavior, dielectric stability, and lifetime under stress. In real deployments, their placement and derating strategy often decide whether a design passes EMC and survives long-term thermal exposure. In industrial power supplies, lifetime and ripple performance determine reliability in hot enclosures. Within inverters and motor drives, ripple current capability and thermal rise determine whether capacitors survive long duty cycles. In real deployments, across variable-frequency drives, capacitor choices influence EMI, ripple, and thermal stress that can shorten lifetime if margins are thin. Within motor-control power stages, capacitors are qualified for ripple current and heat rise because stress is repetitive and cumulative.

Compatibility Advice
  • For MACOM Technology Solutions 911R5M-BSP3 in Silicon Capacitors, confirm tolerance, derating, ESR or impedance versus frequency, and thermal rise on the assembled PCB. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Riskier when integrating MACOM Technology Solutions 911R5M-BSP3 for Silicon Capacitors, enclosure constraints prevent validating matching and shielding, so RF behavior is not repeatable, because the remaining risk is system-level and cannot be bounded by datasheet checks alone.
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