ALD1106PBL

ALD1106PBL

$6.54
  • Description:MOSFET 4N-CH 10.6V 14PDIP
  • Series:-

SKU:7e41b2e02d19 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:MOSFET 4N-CH 10.6V 14PDIP
  • Series:-
  • Mfr:Advanced Linear Devices Inc.
  • Package:Tube
  • Technology:MOSFET (Metal Oxide)
  • Configuration:4 N-Channel, Matched Pair
  • FET Feature:-
  • Drain to Source Voltage (Vdss):10.6V
  • Current - Continuous Drain (Id) @ 25°C:-
  • Rds On (Max) @ Id, Vgs:500Ohm @ 5V
  • Vgs(th) (Max) @ Id:1V @ 1µA
  • Gate Charge (Qg) (Max) @ Vgs:-
  • Input Capacitance (Ciss) (Max) @ Vds:3pF @ 5V
  • Power - Max:500mW
  • Operating Temperature:0°C ~ 70°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:14-DIP (0.300", 7.62mm)
  • Supplier Device Package:14-PDIP
  • Grade:-
  • Qualification:-

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ALD1106PBL

Buying Guide
Summary

Advanced Linear Devices Inc. ALD1106PBL is used in FET, MOSFET Arrays category where integration and verification need to stay predictable. Key specs include Description (MOSFET 4N-CH 10.6V 14PDIP), Packaging (Tube), Temperature (0°C ~ 70°C (TJ)), Package/case (14-DIP (0.300", 7.62mm)), and Mounting (Through Hole).

Selection Notes
  • For ALD1106PBL, confirm the operating temperature range (0°C ~ 70°C (TJ)) meets your deployment conditions.
  • Verify Rds On (Max) @ Id, Vgs (500Ohm @ 5V) and compare it against your reference design limits.
  • Make sure the mounting type (Through Hole) matches how the part will be installed and inspected.
  • Ensure the supply current (1V @ 1µA) is acceptable for battery life and thermal limits.
Alternates & Substitutions
  • For FET, MOSFET Arrays, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Start by confirming the physical match (package/case 14-DIP (0.300", 7.62mm), supplier package 14-PDIP, mounting Through Hole) so the swap does not create a footprint risk.
  • When in doubt, treat the swap as an ECO: define acceptance criteria, then validate under worst-case operating corners.
  • For faster alternate proposals, share the constraints you cannot change (package 14-DIP (0.300", 7.62mm)) and your acceptable trade-offs.
FAQ

What is the mounting method for ALD1106PBL?
Through Hole

What Drain to Source Voltage (Vdss) is listed for ALD1106PBL?
10.6V

Which Rds On (Max) @ Id, Vgs is listed for ALD1106PBL?
500Ohm @ 5V

What is the package/case of ALD1106PBL?
14-DIP (0.300", 7.62mm)

Application Scenarios

Advanced Linear Devices Inc. ALD1106PBL is a common choice in FET, MOSFET Arrays applications where the goal is to keep validation repeatable and avoid edge-case surprises during bring-up. A good discrete switch choice improves efficiency and robustness while keeping thermal design and qualification predictable. In practice, good switch selection keeps losses and temperature rise predictable, which makes qualification and derating easier to defend. Engineers often treat gate drive, layout, and SOA as system-level constraints because they dominate switching behavior and EMI. In automotive electronics, discrete devices are qualified for transients, vibration, and predictable failure modes over thermal cycling. In automotive modules, MOSFETs tolerate transients and inductive kickback while meeting EMI constraints on dense harnessed systems. In motor control and robotics, MOSFET stages must survive stalls and reversals, so SOA and transient strategy are validated under real waveforms.

Compatibility Advice
  • In practice, verify clamp/snubber behavior so overshoot is bounded in production wiring and harnesses before committing to volume builds.
  • To reduce integration risk, confirm short-circuit and fault response behavior matches the system protection plan, because timing often dominates survivability. This helps field behavior stay predictable across lots.
  • Verify clamping/snubber strategy so avalanche or overshoot events are controlled and repeatable in production during bring-up and production test.
Project Fit
  • A weaker fit when integrating Advanced Linear Devices Inc. ALD1106PBL for FET, MOSFET Arrays, snubber or clamp behavior is undefined, so overvoltage and EMI risk remains open, because the remaining risk is system-level and cannot be bounded by datasheet checks alone.
  • Works best when you can test and document Advanced Linear Devices Inc. ALD1106PBL for FET, MOSFET Arrays integration with the real wiring and cabling, and you need measurable SOA and transient margins rather than typical-only assumptions.
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