ALD1107SBL

ALD1107SBL

$6.05
  • Description:MOSFET 4P-CH 10.6V 14SOIC
  • Series:-

SKU:80911cb8b31e Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:MOSFET 4P-CH 10.6V 14SOIC
  • Series:-
  • Mfr:Advanced Linear Devices Inc.
  • Package:Tube
  • Technology:MOSFET (Metal Oxide)
  • Configuration:4 P-Channel, Matched Pair
  • FET Feature:-
  • Drain to Source Voltage (Vdss):10.6V
  • Current - Continuous Drain (Id) @ 25°C:-
  • Rds On (Max) @ Id, Vgs:1800Ohm @ 5V
  • Vgs(th) (Max) @ Id:1.2V @ 1µA
  • Gate Charge (Qg) (Max) @ Vgs:-
  • Input Capacitance (Ciss) (Max) @ Vds:3pF @ 5V
  • Power - Max:500mW
  • Operating Temperature:0°C ~ 70°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:14-SOIC
  • Grade:-
  • Qualification:-

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ALD1107SBL

Buying Guide
Summary

Advanced Linear Devices Inc. ALD1107SBL is an electronic component in FET, MOSFET Arrays category. Key specs: description: MOSFET 4P-CH 10.6V 14SOIC; packaging: Tube; temperature: 0°C ~ 70°C (TJ); package/case: 14-SOIC (0.154", 3.90mm Width); mounting: Surface Mount.

Selection Notes
  • For ALD1107SBL, confirm package/case 14-SOIC (0.154", 3.90mm Width), mounting Surface Mount to ensure footprint compatibility.
  • For ALD1107SBL, validate the operating temperature range (0°C ~ 70°C (TJ)) against your environment.
  • For ALD1107SBL, if this is for production, consider sourcing and lifecycle risk (second source / availability) (packaging Tube; temperature 0°C ~ 70°C (TJ)).
FAQ

How can I request a quote for ALD1107SBL?
Send the part number (ALD1107SBL), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for ALD1107SBL?
Advanced Linear Devices Inc.

What is the mounting type of ALD1107SBL?
Surface Mount

What is the supply current of ALD1107SBL?
1.2V @ 1µA

Application Scenarios
Advanced Linear Devices Inc. ALD1107SBL is listed under the FET, MOSFET Arrays category and is commonly used when correctness, reliability, and qualification repeatability matter. Selection focuses on SOA, switching loss, gate charge, package parasitics, and thermal impedance under realistic waveforms. They are essential when a design must handle inductive loads, fast edges, or high current in compact footprints. In harsh environments, package selection affects vibration robustness and heat spreading into PCB copper. In industrial automation, discrete switches drive solenoids and relays near motors, so transient handling and thermal design are critical. Overall, it simplifies bring-up and troubleshooting by making the design easier to validate and support in production.
ALD1107SBLALD1107SBL
$6.05
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