AS7C31025C-12TINTR

AS7C31025C-12TINTR

  • Description:IC SRAM 1MBIT PARALLEL 32TSOP II
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)

SKU:bf4bf0063ddc Category: Brand:

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Product Detailed Parameters

  • Description:IC SRAM 1MBIT PARALLEL 32TSOP II
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Asynchronous
  • Memory Size:1Mbit
  • Memory Organization:128K x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:12ns
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-SOIC (0.400", 10.16mm Width)
  • Supplier Device Package:32-TSOP II
  • Access Time:12 ns
  • Grade:-
  • Qualification:-

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AS7C31025C-12TINTR

Buying Guide
Summary

Alliance Memory, Inc. AS7C31025C-12TINTR is selected in Memory IC category when storage behavior must remain predictable across temperature and production variance. Key specs include Description (IC SRAM 1MBIT PARALLEL 32TSOP II), Temperature (-40°C ~ 85°C (TA)), Package/case (32-SOIC (0.400", 10.16mm Width)), Mounting (Surface Mount), and Packaging (Tape & Reel (TR)).

Selection Notes
  • For AS7C31025C-12TINTR, verify Memory Organization (128K x 8) matches your requirements and the datasheet test conditions.
  • Confirm the mounting type (Surface Mount) matches your assembly process and reliability requirements.
  • Confirm the supply requirement (3V ~ 3.6V) is met during startup, transients, and brownout.
Alternates & Substitutions
  • In Memory IC designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Start with mechanical equivalence and keep package/case 32-SOIC (0.400", 10.16mm Width), supplier package 32-TSOP II, mounting Surface Mount aligned so the alternate is footprint-safe.
  • Confirm the real operating corners (supply 3V ~ 3.6V, temperature -40°C ~ 85°C (TA)) and avoid swaps that only work at typical conditions.
  • For digital parts, align memory 1Mbit and validate firmware/boot and signal integrity assumptions before production.
FAQ

Any tips for reliable operation with AS7C31025C-12TINTR?
Ensure robust power sequencing, adequate decoupling capacitors, and verify signal integrity on high-speed data buses.

What Memory Type is listed for AS7C31025C-12TINTR?
Volatile

Which Memory Size is listed for AS7C31025C-12TINTR?
1Mbit

What Technology is listed for AS7C31025C-12TINTR?
SRAM - Asynchronous

Application Scenarios

Within practice, the question for Alliance Memory, Inc. AS7C31025C-12TINTR in Memory IC is whether it stays inside the electrical/thermal envelope while remaining easy to validate and support. They are typically essential for stable boot flows, logging, configuration retention, and smoothing bursty traffic in pipelines. A strong memory choice improves responsiveness and generally reduces the probability of data-loss edge cases in the field. Within IoT gateways, reliable storage supports OTA rollback and stable boot flows during brownouts. Across measurement systems, data buffering supports high-throughput capture sessions without dropping samples. Within industrial controllers, memory stores calibration and event logs so field issues can be diagnosed after power interruptions and network outages.

Compatibility Advice
  • With the real source, load, and wiring, check long-term data retention and temperature exposure so storage behavior stays inside the product lifecycle targets. This keeps qualification evidence reproducible later.
Project Fit
  • A strong fit when you can measure and verify Alliance Memory, Inc. AS7C31025C-12TINTR for Memory IC integration with production-like fixtures, if you can manage lifecycle constraints like refresh, wear-out, and endurance with a defined workload model.
AS7C31025C-12TINTRAS7C31025C-12TINTR

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