BSM100GB120DLCKHOSA1

BSM100GB120DLCKHOSA1

  • Description:IGBT MOD 1200V 100A 830W
  • Series:-

SKU:6e590c2fc4a6 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MOD 1200V 100A 830W
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:-
  • Configuration:Half Bridge
  • Vce(on) (Max) @ Vge, Ic:-
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):100 A
  • Power - Max:830 W
  • Current - Collector Cutoff (Max):-
  • Input Capacitance (Cies) @ Vce:-

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BSM100GB120DLCKHOSA1

Buying Guide
Summary

Infineon Technologies BSM100GB120DLCKHOSA1 is an electronic component in IGBT Modules category. Key specs: description: IGBT MOD 1200V 100A 830W; packaging: Tray; temperature: -40°C ~ 125°C; package/case: Module; mounting: Chassis Mount; input: Standard.

Selection Notes
  • For BSM100GB120DLCKHOSA1, confirm package/case Module, mounting Chassis Mount to ensure footprint compatibility.
  • For BSM100GB120DLCKHOSA1, validate the operating temperature range (-40°C ~ 125°C) against your environment.
  • For BSM100GB120DLCKHOSA1, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (mounting Chassis Mount; packaging Tray).
FAQ

What information do you need to quote BSM100GB120DLCKHOSA1?
Send the part number (BSM100GB120DLCKHOSA1), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for BSM100GB120DLCKHOSA1?
Infineon Technologies

What is the supply current of BSM100GB120DLCKHOSA1?
100 A

What is the packaging of BSM100GB120DLCKHOSA1?
Tray

Application Scenarios
Infineon Technologies BSM100GB120DLCKHOSA1 is listed under the IGBT Modules category and is commonly used when correctness, reliability, and qualification repeatability matter. Selection focuses on SOA, switching loss, gate charge, package parasitics, and thermal impedance under realistic waveforms. They are essential when a design must handle inductive loads, fast edges, or high current in compact footprints. In harsh environments, package selection affects vibration robustness and heat spreading into PCB copper. In industrial automation, discrete switches drive solenoids and relays near motors, so transient handling and thermal design are critical. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
BSM100GB120DLCKHOSA1BSM100GB120DLCKHOSA1

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