DB3

DB3

$0.12
  • Description:DIAC DO-35 28V 36V
  • Series:-

SKU:799ae762df57 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DIAC DO-35 28V 36V
  • Series:-
  • Mfr:Diotec Semiconductor
  • Package:Cut Tape (CT),Tape & Box (TB)
  • Voltage - Breakover:28 ~ 36V
  • Current - Breakover:200 µA
  • Current - Peak Output:2 A
  • Operating Temperature:-50°C ~ 100°C (TJ)
  • Package / Case:DO-204AH, DO-35, Axial
  • Supplier Device Package:DO-35
  • Current - Hold (Ih) (Max):-

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DB3

Buying Guide
Summary

Diotec Semiconductor DB3 is used in DIACs, SIDACs category for data acquisition and conversion designs where interface timing and accuracy margins matter. Key specs include Description (DIAC DO-35 28V 36V), Temperature (-50°C ~ 100°C (TJ)), Package/case (DO-204AH, DO-35, Axial), and Packaging (Cut Tape (CT), Tape & Box (TB)).

Selection Notes
  • For DB3, confirm the operating temperature range (-50°C ~ 100°C (TJ)) meets your deployment conditions.
  • Double-check Current - Peak Output (2 A) against your specification and operating conditions.
  • Double-check the package/case (DO-204AH, DO-35, Axial) and recommended land pattern before ordering.
  • Ensure the supply current (200 µA) is acceptable for battery life and thermal limits.
Alternates & Substitutions
  • For DIACs, SIDACs, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Then confirm the operating envelope (supply 28 ~ 36V, temperature -50°C ~ 100°C (TJ)) with margin for transients and derating.
  • For ADC/DAC substitutions, verify resolution, sampling rate, and interface timing, then validate SNR/THD in your real signal chain.
  • Confirm startup states and fault behavior are equivalent so the alternate does not change system behavior during brownouts or resets.
FAQ

Who is the manufacturer of DB3?
Diotec Semiconductor

What is the Current - Peak Output of DB3?
2 A

Which packaging option is listed for DB3?
Cut Tape (CT), Tape & Box (TB)

What Supplier Device Package is listed for DB3?
DO-35

Application Scenarios

In practice, for Diotec Semiconductor DB3 in the DIACs, SIDACs category, teams usually prioritize documentation clarity and repeatable behavior in production. DAC performance in real systems depends on output filtering, load compliance, glitch energy, and reference/clock cleanliness. Design decisions usually revolve around dynamic range, linearity, reference stability, and how the part connects to an MCU, DSP, or FPGA. In practice, they often include analog front-end functions such as filtering, buffering, multiplexing, or isolation that reduce external component count. In industrial automation, signal-chain choices are validated for EMI resilience and repeatable accuracy near motors and contactors. In real deployments, across automated test equipment, DACs generate stimulus waveforms and programmable bias points for calibration routines inside shielded racks with strict settling and SFDR targets. By keeping assumptions testable, teams can iterate faster without accumulating hidden technical debt.

Compatibility Advice
  • For production stability, check glitch energy and update transients under your real step sizes so downstream stages remain stable. This keeps qualification evidence reproducible later.
  • For compatibility, check anti-alias and reconstruction filtering with real signals so system-level error is bounded. This helps field behavior stay predictable across lots.
Project Fit
  • Usually not a good fit when integrating Diotec Semiconductor DB3 for DIACs, SIDACs, output filtering and load behavior are not defined, leaving spurs and settling unpredictable in the system, because the remaining risk is system-level and cannot be bounded by datasheet checks alone.
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