DD200S33K2CC1NOSA1

DD200S33K2CC1NOSA1

$1,412.00
  • Description:DIODE MOD GP 3300V 200A AIHV73-3
  • Series:-

SKU:e4158e2478cb Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:chipapexlimited@gmail.com
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

*
*
*
*
Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:DIODE MOD GP 3300V 200A AIHV73-3
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk,Tray
  • Diode Configuration:1 Pair Series Connection
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):3300 V
  • Current - Average Rectified (Io) (per Diode):200A (DC)
  • Voltage - Forward (Vf) (Max) @ If:3.5 V @ 200 A
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:-
  • Operating Temperature - Junction:-40°C ~ 125°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:A-IHV73-3
  • Grade:-
  • Qualification:-

Download product information

DD200S33K2CC1NOSA1

Buying Guide
Summary

Infineon Technologies DD200S33K2CC1NOSA1 is a component in Diode Arrays category typically evaluated for fit, operating limits, and supportability in production. Key specs include Description (DIODE MOD GP 3300V 200A AIHV73-3), Packaging (Bulk, Tray), Temperature (-40°C ~ 125°C), Package/case (Module), and Mounting (Chassis Mount).

Selection Notes
  • For DD200S33K2CC1NOSA1, verify the package/case (Module) fits your mechanical constraints and assembly process.
  • Make sure the supply current (200A (DC)) fits your power budget in all modes.
  • Validate the operating temperature range (-40°C ~ 125°C) for your environment and margin.
Alternates & Substitutions
  • For Diode Arrays, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Before approving a second source, compare the functional mode matrix and the test conditions behind the marketing headline specs.
  • Start with mechanical equivalence and keep package/case Module, supplier package A-IHV73-3, mounting Chassis Mount aligned so the alternate is footprint-safe.
  • Confirm compliance/qualification needs (for example RoHS/REACH or grade) before approving a second source for production.
FAQ

What operating temperature range is listed for DD200S33K2CC1NOSA1?
-40°C ~ 125°C

Which supply current is specified for DD200S33K2CC1NOSA1?
200A (DC)

Can you confirm the Technology for DD200S33K2CC1NOSA1?
Standard

What mounting type does DD200S33K2CC1NOSA1 use?
Chassis Mount

Application Scenarios

Within practice, the question for Infineon Technologies DD200S33K2CC1NOSA1 in Diode Arrays is whether it stays inside the electrical/thermal envelope while remaining easy to validate and support. They are generally used for rectification and current steering where recovery behavior and leakage influence heat and noise in real operation. They often appear in power stages for rectification and polarity protection where predictable recovery and thermal margins matter. In UPS front ends and industrial drives, rectifier stages are validated for repeatable margins in 24/7 operation with constrained airflow. Across welding and industrial heating equipment, diode modules see high pulse currents where mounting, cooling, and current sharing determine reliability. In renewable-energy conversion, diode rectification stages support high-voltage DC links where insulation system and thermal margins are treated as system-level constraints. Engineers often validate mounting, creepage/clearance, cooling, and current sharing under the real waveform because module integration often dominates field reliability.

Compatibility Advice
  • Across temperature and supply corners, verify creepage/clearance and insulation coordination against the full reverse-voltage rating, including mounting hardware and contamination paths. This keeps acceptance criteria measurable and repeatable.
  • For compatibility, check leakage and temperature drift at the real operating voltage so standby loss and thermal rise do not surprise you later. This keeps qualification evidence reproducible later.
  • Before freezing the BOM, confirm the relevant surge and repetitive pulse conditions, because diode stress is waveform-driven rather than only DC current-driven. This keeps integration from depending on typical-only conditions.
Project Fit
  • Good fit when you can measure and verify Infineon Technologies DD200S33K2CC1NOSA1 for Diode Arrays integration under realistic load and noise, and you can validate thermal rise, surge stress, and leakage behavior on production-like hardware.
  • Poor fit when thermal paths and mounting conditions vary widely and cannot be validated across builds, because integration risk stays high when key margins cannot be measured.
DD200S33K2CC1NOSA1DD200S33K2CC1NOSA1
$1,412.00
Buy Now