DZ3600S17K3B2NOSA1

DZ3600S17K3B2NOSA1

$1,064.03
  • Description:DIODE MODULE GP 1700V AIHM190-1
  • Series:-

SKU:28db54d70478 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DIODE MODULE GP 1700V AIHM190-1
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Diode Configuration:3 Independent
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):1700 V
  • Current - Average Rectified (Io) (per Diode):-
  • Voltage - Forward (Vf) (Max) @ If:2.2 V @ 3600 A
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:-
  • Operating Temperature - Junction:-40°C ~ 125°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:A-IHM190-1
  • Grade:-
  • Qualification:-

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DZ3600S17K3B2NOSA1

Buying Guide
Summary

Infineon Technologies DZ3600S17K3B2NOSA1 is used in Diode Arrays category where integration and verification need to stay predictable. Key specs include Description (DIODE MODULE GP 1700V AIHM190-1), Packaging (Tray), Temperature (-40°C ~ 125°C), Package/case (Module), and Mounting (Chassis Mount).

Selection Notes
  • For DZ3600S17K3B2NOSA1, confirm the supply current (2.2 V @ 3600 A) is acceptable for standby and active operation.
  • Verify the operating temperature range (-40°C ~ 125°C) and derate as needed in your application.
  • Confirm Voltage - Forward (Vf) (Max) @ If (2.2 V @ 3600 A) meets your design constraints and system-level expectations.
  • Double-check the mounting type (Chassis Mount) for your intended installation method.
Alternates & Substitutions
  • For Diode Arrays, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Then confirm the operating envelope (temperature -40°C ~ 125°C) with margin for transients and derating.
  • Confirm compliance/qualification needs (for example RoHS/REACH or grade) before approving a second source for production.
  • If substitutions are likely, write down the non-negotiables and re-check them when the supply chain changes, not after field failures.
FAQ

What should I compare when selecting an alternate for DZ3600S17K3B2NOSA1?
Compare footprint/pinout, key electrical limits, temperature range, and interface requirements, then validate under worst-case conditions.

Which Voltage - DC Reverse (Vr) (Max) is listed for DZ3600S17K3B2NOSA1?
1700 V

Which Speed is specified for DZ3600S17K3B2NOSA1?
Standard Recovery >500ns, > 200mA (Io)

Which Diode Configuration is listed for DZ3600S17K3B2NOSA1?
3 Independent

Application Scenarios

When Infineon Technologies DZ3600S17K3B2NOSA1 is used in Diode Arrays designs, teams typically start by confirming interfaces, supply rails, operating envelope, and qualification expectations. In practice, high-voltage diode array modules are selected around reverse-voltage headroom, average and surge current, recovery behavior, leakage, and thermal path into the heatsink. They control current direction and clamp transients, protecting circuits and enabling robust AC or DC power handling. Engineers generally check reverse voltage, surge capability, recovery behavior, leakage, and thermal dissipation in worst-case stress. In practice, within traction and rail power electronics, diode modules are selected for surge robustness and stable behavior over long thermal cycling. In UPS front ends and industrial drives, rectifier modules must handle repetitive stress and temperature rise while maintaining stable leakage and recovery behavior. In practice, this keeps the design closer to the datasheet boundaries and farther from fragile, layout-dependent behavior.

Compatibility Advice
  • For production stability, validate recovery behavior and dv/dt interactions with wiring inductance so commutation does not create overvoltage or EMI surprises before committing to volume builds.
  • Across temperature and supply corners, verify dv/dt and recovery behavior interactions with wiring inductance and snubbers so overvoltage remains bounded. This keeps qualification evidence reproducible later.
  • In board-level integration, verify repetitive peak current and junction heating against the actual waveform so thermal cycling does not become the hidden limiter. This keeps qualification evidence reproducible later.
Project Fit
  • Best fit for Diode Arrays when you can validate surge waveforms, recovery behavior, creepage/clearance, and thermal rise under realistic wiring and loading.
DZ3600S17K3B2NOSA1DZ3600S17K3B2NOSA1
$1,064.03
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