FII24N170AH1

FII24N170AH1

  • Description:IGBT H BRIDGE 1700V 18A I4PAK5
  • Series:-

SKU:e8c3ca60374f Category: Brand:

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Product Detailed Parameters

  • Description:IGBT H BRIDGE 1700V 18A I4PAK5
  • Series:-
  • Mfr:IXYS
  • Package:Tube
  • IGBT Type:NPT
  • Configuration:Half Bridge
  • Voltage - Collector Emitter Breakdown (Max):1700 V
  • Current - Collector (Ic) (Max):18 A
  • Power - Max:140 W
  • Vce(on) (Max) @ Vge, Ic:6V @ 15V, 16A
  • Current - Collector Cutoff (Max):100 µA
  • Input Capacitance (Cies) @ Vce:2.4 nF @ 25 V
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:i4-Pac™-4, Isolated
  • Supplier Device Package:ISOPLUS i4-PAC™

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FII24N170AH1

Buying Guide
Summary

IXYS FII24N170AH1 is an electronic component in IGBT Arrays category. Key specs: description: IGBT H BRIDGE 1700V 18A I4PAK5; packaging: Tube; temperature: -55°C ~ 150°C (TJ); package/case: i4-Pac™-4, Isolated; mounting: Through Hole; input: Standard.

Selection Notes
  • For FII24N170AH1, confirm package/case i4-Pac™-4, Isolated, mounting Through Hole to ensure footprint compatibility.
  • For FII24N170AH1, validate the operating temperature range (-55°C ~ 150°C (TJ)) against your environment.
  • For FII24N170AH1, for replacements, match pinout/footprint first, then verify min/max ratings and timing margins (mounting Through Hole; packaging Tube).
FAQ

What should I provide for an accurate quote for FII24N170AH1?
Send the part number (FII24N170AH1), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for FII24N170AH1?
IXYS

What is the supply current of FII24N170AH1?
18 A

What is the packaging of FII24N170AH1?
Tube

Application Scenarios
IXYS FII24N170AH1 is listed under the IGBT Arrays category and is commonly used when correctness, reliability, and qualification repeatability matter. Selection focuses on SOA, switching loss, gate charge, package parasitics, and thermal impedance under realistic waveforms. They are essential when a design must handle inductive loads, fast edges, or high current in compact footprints. In harsh environments, package selection affects vibration robustness and heat spreading into PCB copper. In industrial automation, discrete switches drive solenoids and relays near motors, so transient handling and thermal design are critical. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
FII24N170AH1FII24N170AH1

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