FII30-06D

FII30-06D

$5.42
  • Description:IGBT H BRIDGE 600V 30A I4PAK5
  • Series:-

SKU:74be653f80c0 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IGBT H BRIDGE 600V 30A I4PAK5
  • Series:-
  • Mfr:IXYS
  • Package:Tube
  • IGBT Type:NPT
  • Configuration:Half Bridge
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):30 A
  • Power - Max:100 W
  • Vce(on) (Max) @ Vge, Ic:2.4V @ 15V, 20A
  • Current - Collector Cutoff (Max):600 µA
  • Input Capacitance (Cies) @ Vce:1.1 nF @ 25 V
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:i4-Pac™-5
  • Supplier Device Package:ISOPLUS i4-PAC™

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FII30-06D

Buying Guide
Summary

IXYS FII30-06D is an electronic component in IGBT Arrays category. Key specs: description: IGBT H BRIDGE 600V 30A I4PAK5; packaging: Tube; temperature: -55°C ~ 150°C (TJ); package/case: i4-Pac™-5; mounting: Through Hole; input: Standard.

Selection Notes
  • For FII30-06D, confirm package/case i4-Pac™-5, mounting Through Hole to ensure footprint compatibility.
  • For FII30-06D, validate the operating temperature range (-55°C ~ 150°C (TJ)) against your environment.
  • For FII30-06D, for replacements, match pinout/footprint first, then verify min/max ratings and timing margins (temperature -55°C ~ 150°C (TJ); package/case i4-Pac™-5).
FAQ

How can I request a quote for FII30-06D?
Send the part number (FII30-06D), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for FII30-06D?
IXYS

What is the supply current of FII30-06D?
30 A

What is the packaging of FII30-06D?
Tube

Application Scenarios
IXYS FII30-06D in the IGBT Arrays category is typically selected when engineers need predictable, spec-driven behavior in a production design. Good discrete choices improve efficiency and robustness while keeping BOM cost and thermal design manageable. They switch or amplify current and voltage, enabling load control, power conversion, and signal conditioning at the component level. In automotive electronics, switching devices survive load dumps and inductive kickback while meeting EMI constraints. In power adapters, MOSFET choices influence efficiency, heat, and audible noise during burst-mode operation. In robotics, motor switching stages must handle stalls and rapid reversals without entering unsafe SOA conditions. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
FII30-06DFII30-06D
$5.42
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