IKCM30F60GAXKMA1

IKCM30F60GAXKMA1

$11.70
  • Description:IFPS MODULE 600V 30A 24PWRDIP
  • Series:CIPOS™

SKU:7b33e366014f Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IFPS MODULE 600V 30A 24PWRDIP
  • Series:CIPOS™
  • Mfr:Infineon Technologies
  • Package:Tube
  • Type:IGBT
  • Configuration:3 Phase
  • Current:30 A
  • Voltage:600 V
  • Voltage - Isolation:2000Vrms
  • Mounting Type:Through Hole
  • Package / Case:24-PowerDIP Module (1.028", 26.10mm)
  • Grade:-
  • Qualification:-

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IKCM30F60GAXKMA1

Buying Guide
Summary

Infineon Technologies IKCM30F60GAXKMA1 is an electronic component in Power Driver Modules category. Key specs: description: IFPS MODULE 600V 30A 24PWRDIP; series: CIPOS™; type: IGBT; packaging: Tube; package/case: 24-PowerDIP Module (1.028", 26.10mm); mounting: Through Hole.

Selection Notes
  • For IKCM30F60GAXKMA1, confirm package/case 24-PowerDIP Module (1.028", 26.10mm), mounting Through Hole to ensure footprint compatibility.
  • For IKCM30F60GAXKMA1, confirm packaging option and moisture sensitivity handling if your assembly process requires it (package/case 24-PowerDIP Module (1.028", 26.10mm); mounting Through Hole).
  • For IKCM30F60GAXKMA1, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (series CIPOS™; package/case 24-PowerDIP Module (1.028", 26.10mm)).
FAQ

What information do you need to quote IKCM30F60GAXKMA1?
Send the part number (IKCM30F60GAXKMA1), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for IKCM30F60GAXKMA1?
Infineon Technologies

What is the packaging of IKCM30F60GAXKMA1?
Tube

What is the package/case of IKCM30F60GAXKMA1?
24-PowerDIP Module (1.028", 26.10mm)

Application Scenarios
For Infineon Technologies IKCM30F60GAXKMA1 in the Power Driver Modules category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They manage conversion, sequencing, and supervision so rails remain stable under load steps, brownouts, and surge conditions. Engineers evaluate efficiency, thermal rise, transient response, EMI behavior, and fault handling to protect sensitive downstream circuits. In edge servers and communications modules, multi-rail sequencing and telemetry protect CPUs, FPGAs, and memory during rapid load steps. In battery-powered tools and medical devices, conversion efficiency and low quiescent current extend runtime without compromising transient behavior. Overall, it improves predictability by keeping key performance stable across manufacturing variance and operating conditions.
IKCM30F60GAXKMA1IKCM30F60GAXKMA1
$11.70
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