IXA30PG1200DHG-TUB

IXA30PG1200DHG-TUB

  • Description:IGBT H BRIDGE 1200V 43A SMPD
  • Series:-

SKU:8dbf909abc2a Category: Brand:

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Product Detailed Parameters

  • Description:IGBT H BRIDGE 1200V 43A SMPD
  • Series:-
  • Mfr:IXYS
  • Package:Tube
  • IGBT Type:PT
  • Configuration:Half Bridge
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):43 A
  • Power - Max:150 W
  • Vce(on) (Max) @ Vge, Ic:2.2V @ 15V, 25A
  • Current - Collector Cutoff (Max):2.1 mA
  • Input Capacitance (Cies) @ Vce:-
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:9-SMD Module
  • Supplier Device Package:ISOPLUS-SMPD™.B

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IXA30PG1200DHG-TUB

Buying Guide
Summary

IXYS IXA30PG1200DHG-TUB is an electronic component in IGBT Arrays category. Key specs: description: IGBT H BRIDGE 1200V 43A SMPD; packaging: Tube; temperature: -55°C ~ 150°C (TJ); package/case: 9-SMD Module; mounting: Surface Mount; input: Standard.

Selection Notes
  • For IXA30PG1200DHG-TUB, confirm package/case 9-SMD Module, mounting Surface Mount to ensure footprint compatibility.
  • For IXA30PG1200DHG-TUB, validate the operating temperature range (-55°C ~ 150°C (TJ)) against your environment.
  • For IXA30PG1200DHG-TUB, confirm packaging option and moisture sensitivity handling if your assembly process requires it (packaging Tube; temperature -55°C ~ 150°C (TJ)).
FAQ

What should I provide for an accurate quote for IXA30PG1200DHG-TUB?
Send the part number (IXA30PG1200DHG-TUB), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for IXA30PG1200DHG-TUB?
IXYS

What is the supply current of IXA30PG1200DHG-TUB?
43 A

What is the packaging of IXA30PG1200DHG-TUB?
Tube

Application Scenarios
IXYS IXA30PG1200DHG-TUB is listed under the IGBT Arrays category and is commonly used when correctness, reliability, and qualification repeatability matter. Selection focuses on SOA, switching loss, gate charge, package parasitics, and thermal impedance under realistic waveforms. They are essential when a design must handle inductive loads, fast edges, or high current in compact footprints. In harsh environments, package selection affects vibration robustness and heat spreading into PCB copper. In industrial automation, discrete switches drive solenoids and relays near motors, so transient handling and thermal design are critical. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
IXA30PG1200DHG-TUBIXA30PG1200DHG-TUB

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