IXA40PG1200DHG-TUB

IXA40PG1200DHG-TUB

  • Description:IGBT H BRIDGE 1200V 63A SMPD
  • Series:-

SKU:bf8ade458cd0 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT H BRIDGE 1200V 63A SMPD
  • Series:-
  • Mfr:IXYS
  • Package:Tube
  • IGBT Type:PT
  • Configuration:Half Bridge
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):63 A
  • Power - Max:230 W
  • Vce(on) (Max) @ Vge, Ic:2.15V @ 15V, 35A
  • Current - Collector Cutoff (Max):150 µA
  • Input Capacitance (Cies) @ Vce:-
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:9-SMD Module
  • Supplier Device Package:ISOPLUS-SMPD™.B

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IXA40PG1200DHG-TUB

Buying Guide
Summary

IXYS IXA40PG1200DHG-TUB is an electronic component in IGBT Arrays category. Key specs: description: IGBT H BRIDGE 1200V 63A SMPD; packaging: Tube; temperature: -55°C ~ 150°C (TJ); package/case: 9-SMD Module; mounting: Surface Mount; input: Standard.

Selection Notes
  • For IXA40PG1200DHG-TUB, confirm package/case 9-SMD Module, mounting Surface Mount to ensure footprint compatibility.
  • For IXA40PG1200DHG-TUB, validate the operating temperature range (-55°C ~ 150°C (TJ)) against your environment.
  • For IXA40PG1200DHG-TUB, for replacements, match pinout/footprint first, then verify min/max ratings and timing margins (package/case 9-SMD Module; mounting Surface Mount).
FAQ

How can I request a quote for IXA40PG1200DHG-TUB?
Send the part number (IXA40PG1200DHG-TUB), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for IXA40PG1200DHG-TUB?
IXYS

What is the operating temperature range of IXA40PG1200DHG-TUB?
-55°C ~ 150°C (TJ)

What is the package/case of IXA40PG1200DHG-TUB?
9-SMD Module

Application Scenarios
IXYS IXA40PG1200DHG-TUB in the IGBT Arrays category is typically selected when engineers need predictable, spec-driven behavior in a production design. Good discrete choices improve efficiency and robustness while keeping BOM cost and thermal design manageable. They switch or amplify current and voltage, enabling load control, power conversion, and signal conditioning at the component level. In automotive electronics, switching devices survive load dumps and inductive kickback while meeting EMI constraints. In power adapters, MOSFET choices influence efficiency, heat, and audible noise during burst-mode operation. In robotics, motor switching stages must handle stalls and rapid reversals without entering unsafe SOA conditions. Overall, it strengthens system robustness by aligning electrical, thermal, and mechanical constraints with real deployment conditions.
IXA40PG1200DHG-TUBIXA40PG1200DHG-TUB

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