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ST25TV64K-AP6G3

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— IC芯片 | 连接器 | 传感器 | 被动器件 —

ST25TV64K-AP6G3

ST25TV64K-AP6G3

  • Description：IC RFID TRANSP 13.56MHZ WAFER
  • Series：ST25T
  • Mfr：STMicroelectronics
  • Package：Bulk

SKU:1def250f8e9d Category: Brand:

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Product Detailed Parameters

  • Description：IC RFID TRANSP 13.56MHZ WAFER
  • Series：ST25T
  • Mfr：STMicroelectronics
  • Package：Bulk
  • Type：RFID Transponder
  • Frequency：13.56MHz
  • Standards：ISO 15693
  • Interface：-
  • Voltage - Supply：-
  • Operating Temperature：-40°C ~ 85°C
  • Mounting Type：Surface Mount
  • Package / Case：Die
  • Supplier Device Package：Wafer
  • Grade：-
  • Qualification：-

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ST25TV64K-AP6G3

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

STMicroelectronics ST25TV64K-AP6G3 is evaluated in RFID, RF Access, Monitoring ICs category when frequency coverage and integration details must hold up in the real enclosure. Key specs include Description (IC RFID TRANSP 13.56MHZ WAFER), Temperature (-40°C ~ 85°C), Package/case (Die), Mounting (Surface Mount), and Packaging (Bulk).

Selection Notes
  • For ST25TV64K-AP6G3, check Standards (ISO 15693) against the datasheet conditions and your system-level constraints.
  • Verify the package/case (Die) fits your mechanical constraints and assembly process.
  • Verify the operating frequency (13.56MHz) matches your timing and performance targets.
Alternates & Substitutions
  • For RFID, RF Access, Monitoring ICs substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Verify the alternate can be tested with your existing fixtures and acceptance criteria so production verification stays repeatable.
  • Treat package/case Die, supplier package Wafer, mounting Surface Mount as the first filter, then move on to electrical and performance checks.
  • For RF parts, validate the alternate in the real enclosure and cabling, not only in a bench setup.
FAQ

What are common selection points for RF parts like ST25TV64K-AP6G3?
Compare frequency coverage, loss/isolation trade-offs, power handling, and mechanical interface constraints (connectors, mounting).

How is ST25TV64K-AP6G3 supplied (packaging)?
Bulk

What operating temperature range does ST25TV64K-AP6G3 support?
-40°C ~ 85°C

Which operating frequency is specified for ST25TV64K-AP6G3?
13.56MHz

Application Scenarios

In many RFID, RF Access, Monitoring ICs builds, STMicroelectronics ST25TV64K-AP6G3 is reviewed for predictable behavior, supportability, and stable qualification evidence. In real deployments, teams generally focus on layout discipline, controlled impedance, grounding, and shielding to prevent spurs, desense, and compliance failures. Their specifications directly influence link budget, sensitivity, selectivity, and emission margins in crowded spectrum environments. Across industrial handheld radios, robustness is validated against shock, vibration, and battery sag without desense. In practice, within industrial handhelds, RF stability is validated under drops, vibration, and battery sag so links do not desense or intermittently fail. In industrial handheld radios, RF robustness is validated under shock and battery sag because enclosure effects and supply droop change margins.

Compatibility Advice
  • Before committing to volume builds, confirm spurious and harmonic behavior under your real modulation and supply noise so compliance margins are measurable. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • A strong fit when you can qualify STMicroelectronics ST25TV64K-AP6G3 for RFID, RF Access, Monitoring ICs integration in the final enclosure, when you have a defined frequency plan and filtering strategy from the start.
  • A practical check is to define acceptance criteria and validate the key assumptions in the final enclosure before approving substitutions.
ST25TV64K-AP6G3ST25TV64K-AP6G3

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