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ST25TV64KC-APG3

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ST25TV64KC-APG3

ST25TV64KC-APG3

$0.43
  • Description：ST25 DYNAMIC TAGS_MM
  • Series：-
  • Mfr：STMicroelectronics
  • Package：Bulk

SKU:b5d7e5305e36 Category: Brand:

　　
  • Quantity
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Product Detailed Parameters

  • Description：ST25 DYNAMIC TAGS_MM
  • Series：-
  • Mfr：STMicroelectronics
  • Package：Bulk
  • Type：RFID Transponder
  • Frequency：13.56MHz
  • Standards：ISO 15693, ISO 18000-3
  • Interface：-
  • Voltage - Supply：-
  • Operating Temperature：-40°C ~ 85°C (TA)
  • Mounting Type：Surface Mount
  • Package / Case：Die
  • Supplier Device Package：Die
  • Grade：-
  • Qualification：-

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ST25TV64KC-APG3

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

STMicroelectronics ST25TV64KC-APG3 is used in RFID, RF Access, Monitoring ICs category in RF signal paths where layout, grounding, and interface choices determine real performance. Key specs include Description (ST25 DYNAMIC TAGS_MM), Temperature (-40°C ~ 85°C (TA)), Package/case (Die), Mounting (Surface Mount), and Packaging (Bulk).

Selection Notes
  • For ST25TV64KC-APG3, confirm the operating temperature range (-40°C ~ 85°C (TA)) meets your deployment conditions.
  • Confirm Standards (ISO 15693, ISO 18000-3) is suitable for your use case and operating conditions.
  • Confirm the mounting type (Surface Mount) matches your assembly process and reliability requirements.
Alternates & Substitutions
  • For RFID, RF Access, Monitoring ICs, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • When replacing parts, validate corner behavior and recovery paths so failures remain diagnosable in the deployed system.
  • Check that temperature -40°C ~ 85°C (TA) matches your system, then validate at corners instead of relying on typical values.
  • For RF parts, validate the alternate in the real enclosure and cabling, not only in a bench setup.
FAQ

Any tips for integrating ST25TV64KC-APG3 into an RF signal path?
Pay attention to impedance continuity, grounding, connector transitions, and layout symmetry to minimize loss and reflections.

Can you confirm the package/case for ST25TV64KC-APG3?
Die

What temperature range is listed for ST25TV64KC-APG3?
-40°C ~ 85°C (TA)

What operating frequency does ST25TV64KC-APG3 run at?
13.56MHz

Application Scenarios

Across production RFID, RF Access, Monitoring ICs builds, parts like STMicroelectronics ST25TV64KC-APG3 are shortlisted for predictable behavior, clear documentation, and stable supply. Teams often favor RF parts with clear reference layouts and measured example designs, because layout determines whether the numbers are reachable. A robust RF choice reduces late surprises by keeping coexistence and emissions behavior predictable under routing constraints. In satellite and telemetry links, predictable emissions and stable link margin matter across long lifecycles. In tracking beacons, antenna detuning from packaging and mounting dominates outcomes, so validation uses the real enclosure. In outdoor sensors, moisture and condensation change RF conditions, so robustness is validated under real weather exposure.

Compatibility Advice
  • In practice, validate matching, grounding, and shielding in the final enclosure because RF performance is layout- and mechanics-dependent before release to production.
Project Fit
  • A weaker fit when integrating STMicroelectronics ST25TV64KC-APG3 for RFID, RF Access, Monitoring ICs, enclosure constraints prevent validating matching and shielding, so RF behavior is not repeatable, because it becomes difficult to prove margin across production variance.
ST25TV64KC-APG3ST25TV64KC-APG3
$0.43
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