TC74HC74AF(EL,F)

TC74HC74AF(EL,F)

  • Description:IC FF D-TYPE DUAL 1BIT 14SOIC
  • Series:74HC
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tape & Reel (TR)

SKU:78bf30ccfa48 Category: Brand:

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Product Detailed Parameters

  • Description:IC FF D-TYPE DUAL 1BIT 14SOIC
  • Series:74HC
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tape & Reel (TR)
  • Function:Set(Preset) and Reset
  • Type:D-Type
  • Output Type:Complementary
  • Number of Elements:2
  • Number of Bits per Element:1
  • Clock Frequency:67 MHz
  • Max Propagation Delay @ V, Max CL:26ns @ 6V, 50pF
  • Trigger Type:Positive Edge
  • Current - Output High, Low:5.2mA, 5.2mA
  • Voltage - Supply:2V ~ 6V
  • Current - Quiescent (Iq):2 µA
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Supplier Device Package:14-SOP
  • Package / Case:14-SOIC (0.209", 5.30mm Width)
  • Input Capacitance:5 pF
  • Grade:-
  • Qualification:-

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TC74HC74AF(EL,F)

Buying Guide
Summary

Toshiba Semiconductor and Storage TC74HC74AFELF is used in Flip Flops category where integration and verification need to stay predictable. Key specs include Description (IC FF D-TYPE DUAL 1BIT 14SOIC), Series (74HC), Type (D-Type), Packaging (Tape & Reel (TR)), and Supply (2V ~ 6V).

Selection Notes
  • For TC74HC74AFELF, check that the operating frequency (67 MHz) aligns with your system clocking plan.
  • Confirm the operating temperature range (-40°C ~ 85°C (TA)) meets your deployment conditions.
  • Confirm Max Propagation Delay @ V, Max CL (26ns @ 6V, 50pF) and ensure it matches your integration requirements.
  • Make sure the mounting type (Surface Mount) matches how the part will be installed and inspected.
Alternates & Substitutions
  • In Flip Flops, confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Confirm the real operating corners (supply 2V ~ 6V, temperature -40°C ~ 85°C (TA)) and avoid swaps that only work at typical conditions.
  • For production substitutions, confirm traceability and documentation expectations so the alternate can be released cleanly.
  • Confirm startup states and fault behavior are equivalent so the alternate does not change system behavior during brownouts or resets.
FAQ

Who is the manufacturer of TC74HC74AFELF?
Toshiba Semiconductor and Storage

What Number of Bits per Element is listed for TC74HC74AFELF?
1

What Max Propagation Delay @ V, Max CL does TC74HC74AFELF have?
26ns @ 6V, 50pF

Which Function is specified for TC74HC74AFELF?
Set(Preset) and Reset

Application Scenarios

In many Flip Flops builds, Toshiba Semiconductor and Storage TC74HC74AFELF is reviewed for predictable behavior, supportability, and stable qualification evidence. In practice, teams often choose simple logic to keep failure modes bounded and test cases straightforward during bring-up and qualification. A good logic choice improves robustness by keeping thresholds, fan-out, and edge behavior predictable under real loading. In automotive modules, robust I/O conditioning reduces intermittent faults under vibration and harness noise. Within mixed-voltage systems, level shifting and translation logic prevent bus contention and ensure interface compliance across different I/O standards. Across safety systems, deterministic logic enforces interlocks and fault signaling even when the main controller is rebooting or overloaded. In real deployments, after the schematic looks right, the proof is in measured behavior across corners, not just typical conditions. This is often what separates a prototype that works from a product that stays reliable in the field.

Compatibility Advice
  • For second-source planning, confirm logic-level compatibility, thresholds, and termination so signal integrity does not depend on best-case loading with the real source, load, and wiring.
  • For production stability, verify routing and return paths on high-speed nets so edge quality and crosstalk remain bounded in production. This keeps integration from depending on typical-only conditions.
  • In practice, confirm logic-level compatibility, thresholds, and termination so signal integrity does not depend on best-case loading before freezing the BOM.
Project Fit
  • Works best when you can measure and verify Toshiba Semiconductor and Storage TC74HC74AFELF for Flip Flops integration under realistic load and noise, typically when you can control routing and return paths so signal integrity is repeatable across builds.
TC74HC74AF(EL,F)TC74HC74AF(EL,F)

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