TE0841-01-040-1I

TE0841-01-040-1I

  • Description:IC MODULE USCALE 4GB 32MB
  • Series:TE0841

SKU:d6517bbe630c Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:chipapexlimited@gmail.com
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

*
*
*
*
Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MODULE USCALE 4GB 32MB
  • Series:TE0841
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA Core
  • Core Processor:Kintex UltraScale KU40
  • Co-Processor:-
  • Speed:-
  • Flash Size:32MB
  • RAM Size:4GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

Download product information

TE0841-01-040-1I

Buying Guide
Summary

Trenz Electronic GmbH TE0841-01-040-1I is selected in Microcontrollers, Microprocessor, FPGA Modules category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MODULE USCALE 4GB 32MB), Core (Kintex UltraScale KU40), RAM (4GB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For TE0841-01-040-1I, check Module/Board Type (FPGA Core) against the datasheet conditions and your system-level constraints.
  • Check program memory (32MB) for bootloader, diagnostics, and future headroom.
  • Verify the operating temperature range (-40°C ~ 85°C) and derate as needed in your application.
  • Validate Connector Type (Samtec LSHM) under the expected test conditions in your application.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Before approving a second source, compare the functional mode matrix and the test conditions behind the marketing headline specs.
  • Keep the assembly and footprint constraints consistent (packaging Bulk) to avoid a late PCB change.
  • For digital parts, align memory 4GB and validate firmware/boot and signal integrity assumptions before production.
FAQ

What are common selection points for a microcontroller like TE0841-01-040-1I?
Check flash/RAM headroom, peripheral set, connectivity options, package constraints, and availability for your production horizon.

Which Size / Dimension is listed for TE0841-01-040-1I?
1.970" L x 1.570" W (50.00mm x 40.00mm)

What Flash Size is listed for TE0841-01-040-1I?
32MB

What is the RAM Size of TE0841-01-040-1I?
4GB

Application Scenarios

Trenz Electronic GmbH TE0841-01-040-1I is listed under the Microcontrollers, Microprocessor, FPGA Modules category and is commonly used when correctness, reliability, and qualification repeatability matter. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In practice, well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. Within industrial automation, controllers run deterministic logic and protocol stacks in EMI-heavy cabinets with dust and vibration. Across smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. In practice, within automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. This typically reduces the number of board spins required to reach a stable production release.

Compatibility Advice
  • Before freezing the BOM, verify clock, debug, and programming access so production test and field recovery are practical. This reduces the chance that substitutions push hidden limits.
Project Fit
  • Less ideal when integrating Trenz Electronic GmbH TE0841-01-040-1I for Microcontrollers, Microprocessor, FPGA Modules, boot and recovery behavior depends on sequencing and strapping that cannot be controlled across builds, because the key behaviors cannot be confirmed on the assembled system.
TE0841-01-040-1ITE0841-01-040-1I

Click on the inquiry