TE0841-02-035-1I

TE0841-02-035-1I

  • Description:SOM USCALE 2GB DDR4
  • Series:TE0841

SKU:878d89c13391 Category: Brand:

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Product Detailed Parameters

  • Description:SOM USCALE 2GB DDR4
  • Series:TE0841
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA Core
  • Core Processor:Kintex UltraScale KU035
  • Co-Processor:-
  • Speed:-
  • Flash Size:64MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0841-02-035-1I

Buying Guide
Summary

Trenz Electronic GmbH TE0841-02-035-1I is selected in Microcontrollers, Microprocessor, FPGA Modules category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (SOM USCALE 2GB DDR4), Core (Kintex UltraScale KU035), RAM (2GB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For TE0841-02-035-1I, verify Connector Type (B2B) matches your requirements and the datasheet test conditions.
  • Confirm the program memory size (64MB) is sufficient for your firmware image and update plan.
  • Validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
Alternates & Substitutions
  • In Microcontrollers, Microprocessor, FPGA Modules, confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Compare not just numbers but also the conditions: rails, loads, timing, and temperature points behind the spec table.
  • Then confirm the operating envelope (temperature -40°C ~ 85°C) with margin for transients and derating.
  • For digital parts, align memory 2GB and validate firmware/boot and signal integrity assumptions before production.
FAQ

What details help you quote TE0841-02-035-1I quickly?
Send the part number (TE0841-02-035-1I), quantity, target delivery date, and any required packaging or documentation.

Can you confirm the Flash Size for TE0841-02-035-1I?
64MB

Which RAM Size is listed for TE0841-02-035-1I?
2GB

Which packaging option is listed for TE0841-02-035-1I?
Bulk

Application Scenarios

Trenz Electronic GmbH TE0841-02-035-1I shows up under Microcontrollers, Microprocessor, FPGA Modules when designers want a well-bounded, datasheet-driven building block instead of a fragile board-level workaround. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Within IoT deployments, low power and secure boot support long-life outdoor operation. In automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. Within IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability.

Compatibility Advice
  • Validate startup states and default pin configurations so connected peripherals do not enter unsafe modes at reset before freezing the BOM.
Project Fit
  • Best fit when you can bench-verify Trenz Electronic GmbH TE0841-02-035-1I for Microcontrollers, Microprocessor, FPGA Modules integration under realistic load and noise, typically when you can provision programming and debug access so production test and field recovery are practical.
TE0841-02-035-1ITE0841-02-035-1I

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