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TE0841-02-040-1I

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TE0841-02-040-1I

TE0841-02-040-1I

  • Description：IC MODULE USCALE 512MB
  • Series：TE0841

SKU:f944c543f264 Category: Brand:

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Product Detailed Parameters

  • Description：IC MODULE USCALE 512MB
  • Series：TE0841
  • Mfr：Trenz Electronic GmbH
  • Package：Bulk
  • Module/Board Type：FPGA Core
  • Core Processor：Kintex UltraScale KU40
  • Co-Processor：-
  • Speed：-
  • Flash Size：32MB
  • RAM Size：512MB
  • Connector Type：B2B
  • Size / Dimension：1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature：-40°C ~ 85°C

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TE0841-02-040-1I

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

Trenz Electronic GmbH TE0841-02-040-1I is selected in Microcontrollers, Microprocessor, FPGA Modules category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MODULE USCALE 512MB), Core (Kintex UltraScale KU40), RAM (512MB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For TE0841-02-040-1I, confirm the program memory size (32MB) is sufficient for your firmware image and update plan.
  • Validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
  • Check Connector Type (B2B) against the datasheet conditions and your system-level constraints.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Before looking at performance tables, lock packaging Bulk and verify the system envelope (temperature -40°C ~ 85°C) to avoid a non-drop-in swap.
  • For MCU/memory substitutions, match memory 512MB and verify pin-mux, timing margins, and power sequencing.
  • If you already have candidate alternates, share them and we will check the key drop-in risks before you buy.
FAQ

What are common selection points for a microcontroller like TE0841-02-040-1I?
Check flash/RAM headroom, peripheral set, connectivity options, package constraints, and availability for your production horizon.

Which Size / Dimension is listed for TE0841-02-040-1I?
1.970" L x 1.570" W (50.00mm x 40.00mm)

What Flash Size is listed for TE0841-02-040-1I?
32MB

What is the RAM Size of TE0841-02-040-1I?
512MB

Application Scenarios

In real deployments, when sourcing Trenz Electronic GmbH TE0841-02-040-1I for Microcontrollers, Microprocessor, FPGA Modules, engineers typically focus on de-risking integration and keeping validation repeatable. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. In consumer electronics, integration reduces BOM and speeds product iterations while maintaining stable user experience. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Within building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent.

Compatibility Advice
  • In practice, confirm boot mode, strapping, and reset sequencing so bring-up is deterministic across assembly variance before freezing the BOM.
  • For compatibility, validate power-domain assumptions and decoupling near the pins so brownouts and erratic behavior do not appear at temperature corners before freezing the BOM.
  • To keep validation repeatable, check I/O voltage domains and protection so mixed-voltage interfaces do not degrade reliability over time. This keeps qualification evidence reproducible later.
Project Fit
  • Ideal when you can test and document Trenz Electronic GmbH TE0841-02-040-1I for Microcontrollers, Microprocessor, FPGA Modules integration across temperature and supply corners, when you can control power sequencing and decoupling so brownouts and erratic resets are avoided.
TE0841-02-040-1ITE0841-02-040-1I

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