TE0841-02-0401IL

TE0841-02-0401IL

  • Description:IC MODULE
  • Series:TE0841

SKU:dc760215b30c Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE
  • Series:TE0841
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:Kintex UltraScale KU40
  • Co-Processor:-
  • Speed:-
  • Flash Size:64MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0841-02-0401IL

Buying Guide
Summary

Trenz Electronic GmbH TE0841-02-0401IL is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MODULE), Core (Kintex UltraScale KU40), RAM (2GB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For TE0841-02-0401IL, check program memory (64MB) for bootloader, diagnostics, and future headroom.
  • Verify the operating temperature range (-40°C ~ 85°C) and derate as needed in your application.
  • Check Module/Board Type (MCU, FPGA) against the datasheet conditions and your system-level constraints.
  • Make sure Size / Dimension (1.970" L x 1.570" W (50.00mm x 40.00mm)) aligns with your design targets and verification plan.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Verify the alternate stays within temperature -40°C ~ 85°C across startup, load steps, and worst-case temperature.
  • For MCU/memory substitutions, match memory 2GB and verify pin-mux, timing margins, and power sequencing.
  • If you already have candidate alternates, share them and we will check the key drop-in risks before you buy.
FAQ

Who is the manufacturer of TE0841-02-0401IL?
Trenz Electronic GmbH

How is TE0841-02-0401IL packaged?
Bulk

What is the Module/Board Type of TE0841-02-0401IL?
MCU, FPGA

Which operating temperature range is listed for TE0841-02-0401IL?
-40°C ~ 85°C

Application Scenarios

In real deployments, when Trenz Electronic GmbH TE0841-02-0401IL is used in Microcontrollers, Microprocessor, FPGA Modules designs, teams typically start by confirming interfaces, supply rails, operating envelope, and qualification expectations. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. In industrial automation, controllers run deterministic logic and protocol stacks in EMI-heavy cabinets with dust and vibration. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. Within automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. In practice, predictable margins and repeatable validation are what keep field behavior consistent.

Compatibility Advice
  • For production stability, check I/O voltage domains and protection so mixed-voltage interfaces do not degrade reliability over time. This keeps qualification evidence reproducible later.
Project Fit
  • A practical check is to define acceptance criteria and validate the key assumptions on the assembled PCB before approving substitutions.
TE0841-02-0401ILTE0841-02-0401IL

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