TE0841-02-31I21-A

TE0841-02-31I21-A

$1,382.96
  • Description:IC MODULE
  • Series:TE0841

SKU:888d12bd9537 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC MODULE
  • Series:TE0841
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA Core
  • Core Processor:Kintex UltraScale KU035
  • Co-Processor:-
  • Speed:-
  • Flash Size:64MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0841-02-31I21-A

Buying Guide
Summary

Trenz Electronic GmbH TE0841-02-31I21-A is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MODULE), Core (Kintex UltraScale KU035), RAM (2GB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For TE0841-02-31I21-A, check program memory (64MB) for bootloader, diagnostics, and future headroom.
  • Verify the operating temperature range (-40°C ~ 85°C) and derate as needed in your application.
  • Verify Module/Board Type (FPGA Core) matches your requirements and the datasheet test conditions.
Alternates & Substitutions
  • In Microcontrollers, Microprocessor, FPGA Modules, confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Compare not just numbers but also the conditions: rails, loads, timing, and temperature points behind the spec table.
  • Then confirm the operating envelope (temperature -40°C ~ 85°C) with margin for transients and derating.
  • For digital parts, align memory 2GB and validate firmware/boot and signal integrity assumptions before production.
FAQ

Which packaging format is listed for TE0841-02-31I21-A?
Bulk

What Module/Board Type is listed for TE0841-02-31I21-A?
FPGA Core

Which operating temperature range is specified for TE0841-02-31I21-A?
-40°C ~ 85°C

What CPU core does TE0841-02-31I21-A use?
Kintex UltraScale KU035

Application Scenarios

When sourcing Trenz Electronic GmbH TE0841-02-31I21-A for Microcontrollers, Microprocessor, FPGA Modules, engineers typically focus on de-risking integration and keeping validation repeatable. In practice, selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They often sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Across IoT deployments, low power and secure boot support long-life outdoor operation. In automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. Across medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability.

Compatibility Advice
  • To reduce integration risk, confirm memory interface timing and SI assumptions so firmware behavior stays stable across temperature and lot variation during bring-up and production test.
Project Fit
  • Best fit when you can qualify Trenz Electronic GmbH TE0841-02-31I21-A for Microcontrollers, Microprocessor, FPGA Modules integration under realistic load and noise, typically when you can control power sequencing and decoupling so brownouts and erratic resets are avoided. On the other hand, not ideal when integrating Trenz Electronic GmbH TE0841-02-31I21-A for Microcontrollers, Microprocessor, FPGA Modules, boot and recovery behavior depends on sequencing or strapping that cannot be controlled across builds, because it becomes difficult to prove margin across production variance.
TE0841-02-31I21-ATE0841-02-31I21-A
$1,382.96
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