TE0865-02-FBE83MA

TE0865-02-FBE83MA

  • Description:MPSOC MODULE WITH ZYNQ ULTRASCAL
  • Series:Zynq

SKU:c6917e9492da Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:chipapexlimited@gmail.com
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

*
*
*
*
Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:MPSOC MODULE WITH ZYNQ ULTRASCAL
  • Series:Zynq
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA
  • Core Processor:Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
  • Co-Processor:-
  • Speed:-
  • Flash Size:256MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:3.937" L x 2.953" W (100.00mm x 75.00mm)
  • Operating Temperature:0°C ~ 85°C

Download product information

TE0865-02-FBE83MA

Buying Guide
Summary

Trenz Electronic GmbH TE0865-02-FBE83MA is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (MPSOC MODULE WITH ZYNQ ULTRASCAL), Core (Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E), RAM (4GB), and Temperature (0°C ~ 85°C).

Selection Notes
  • For TE0865-02-FBE83MA, check Module/Board Type (FPGA) against the datasheet conditions and your system-level constraints.
  • Check program memory (256MB) for bootloader, diagnostics, and future headroom.
  • Verify the operating temperature range (0°C ~ 85°C) and derate as needed in your application.
  • Validate Connector Type (B2B) under the expected test conditions in your application.
Alternates & Substitutions
  • In Microcontrollers, Microprocessor, FPGA Modules designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Compare not just numbers but also the conditions: rails, loads, timing, and temperature points behind the spec table.
  • Start with mechanical equivalence and keep packaging Bulk aligned so the alternate is footprint-safe.
  • For digital parts, align memory 4GB and validate firmware/boot and signal integrity assumptions before production.
FAQ

What is the Connector Type of TE0865-02-FBE83MA?
B2B

What Size / Dimension is listed for TE0865-02-FBE83MA?
3.937" L x 2.953" W (100.00mm x 75.00mm)

Can you confirm the Flash Size for TE0865-02-FBE83MA?
256MB

Which RAM Size is listed for TE0865-02-FBE83MA?
4GB

Application Scenarios

Trenz Electronic GmbH TE0865-02-FBE83MA is a common choice in Microcontrollers, Microprocessor, FPGA Modules applications where the goal is to keep validation repeatable and avoid edge-case surprises during bring-up. In real deployments, well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. After the schematic looks right, the proof is in measured behavior across corners, not just typical conditions. Taken together, careful selection and validation lower integration risk and raise field reliability.

Compatibility Advice
  • In practice, plan debug and production test access early so firmware loading, boundary checks, and fault recovery are repeatable before release to production.
Project Fit
  • A weaker fit when integrating Trenz Electronic GmbH TE0865-02-FBE83MA for Microcontrollers, Microprocessor, FPGA Modules, I/O voltage domains are uncertain, increasing long-term overstress and compatibility risk, because validation would rely on assumptions that cannot be re-tested later.
TE0865-02-FBE83MATE0865-02-FBE83MA

Click on the inquiry