TE0890-01-25-1C

TE0890-01-25-1C

  • Description:IC MOD SPARTAN-7 100MHZ 64MBIT
  • Series:TE0890

SKU:ca01d2aecf48 Category: Brand:

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Product Detailed Parameters

  • Description:IC MOD SPARTAN-7 100MHZ 64MBIT
  • Series:TE0890
  • Mfr:Trenz Electronic GmbH
  • Package:Box
  • Module/Board Type:FPGA Core
  • Core Processor:Xilinx Spartan-7 XC7S25
  • Co-Processor:-
  • Speed:100MHz
  • Flash Size:64Mbit
  • RAM Size:64Mbit
  • Connector Type:Dual-pinout DIP-40 or 50mil 80 pin connector
  • Size / Dimension:1.060" L x 2.050" W (27.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 70°C

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TE0890-01-25-1C

Buying Guide
Summary

Trenz Electronic GmbH TE0890-01-25-1C is selected in Microcontrollers, Microprocessor, FPGA Modules category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MOD SPARTAN-7 100MHZ 64MBIT), Core (Xilinx Spartan-7 XC7S25), Speed (100MHz), RAM (64Mbit), and Temperature (0°C ~ 70°C).

Selection Notes
  • For TE0890-01-25-1C, verify the available flash/program memory (64Mbit) matches your code size and feature roadmap.
  • Confirm the operating temperature range (0°C ~ 70°C) meets your deployment conditions.
  • Validate Size / Dimension (1.060" L x 2.050" W (27.00mm x 52.00mm)) under the expected test conditions in your application.
  • Confirm Connector Type (Dual-pinout DIP-40 or 50mil 80 pin connector) is suitable for your use case and operating conditions.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Make sure the alternate stays inside your system envelope: temperature 0°C ~ 70°C.
  • Keep the assembly and footprint constraints consistent (packaging Box) to avoid a late PCB change.
  • For digital parts, align speed 100MHz, memory 64Mbit and validate firmware/boot and signal integrity assumptions before production.
FAQ

Any tips for migrating firmware to TE0890-01-25-1C?
Confirm pin functions, peripheral differences, timing assumptions, and memory layout, then validate under worst-case operating conditions.

What Flash Size is listed for TE0890-01-25-1C?
64Mbit

Can you confirm the packaging for TE0890-01-25-1C?
Box

Which Module/Board Type is listed for TE0890-01-25-1C?
FPGA Core

Application Scenarios

In real deployments, trenz Electronic GmbH TE0890-01-25-1C in the Microcontrollers, Microprocessor, FPGA Modules category is typically selected when engineers need predictable, spec-driven behavior in a production design. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They often sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Across consumer electronics, integration reduces BOM and speeds product iterations while maintaining stable user experience. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. In building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent.

Compatibility Advice
  • In qualification work, plan debug and production test access early so firmware loading, boundary checks, and fault recovery are repeatable. This keeps integration from depending on typical-only conditions.
  • In practice, check I/O voltage domains and protection so mixed-voltage interfaces do not degrade reliability over time during bring-up and production test.
Project Fit
  • Best fit for Microcontrollers, Microprocessor, FPGA Modules when you can validate boot/reset sequencing, power integrity, and timing margins across temperature and supply corners.
TE0890-01-25-1CTE0890-01-25-1C

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