TE0890-02-P1C-5-A

TE0890-02-P1C-5-A

  • Description:MOD SPARTAN-7 64MB FLASH SO8W
  • Series:Spartan

SKU:9c98a5fe71d7 Category: Brand:

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Product Detailed Parameters

  • Description:MOD SPARTAN-7 64MB FLASH SO8W
  • Series:Spartan
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:AMD Spartan™ 7 XC7S25-1FTGB196C
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:8MB
  • Connector Type:80 Pin
  • Size / Dimension:2.047" L x 1.063" W (52.00mm x 27.00mm)
  • Operating Temperature:0°C ~ 70°C

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TE0890-02-P1C-5-A

Buying Guide
Summary

Trenz Electronic GmbH TE0890-02-P1C-5-A is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (MOD SPARTAN-7 64MB FLASH SO8W), Core (AMD Spartan™ 7 XC7S25-1FTGB196C), RAM (8MB), and Temperature (0°C ~ 70°C).

Selection Notes
  • For TE0890-02-P1C-5-A, validate the operating temperature range (0°C ~ 70°C) for your environment and margin.
  • Check Connector Type (80 Pin) against the datasheet conditions and your system-level constraints.
  • Confirm Module/Board Type (MCU, FPGA) meets your design constraints and system-level expectations.
  • Confirm Size / Dimension (2.047" L x 1.063" W (52.00mm x 27.00mm)) is suitable for your use case and operating conditions.
Alternates & Substitutions
  • In Microcontrollers, Microprocessor, FPGA Modules designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Compare not just numbers but also the conditions: rails, loads, timing, and temperature points behind the spec table.
  • Confirm the real operating corners (temperature 0°C ~ 70°C) and avoid swaps that only work at typical conditions.
  • For digital parts, align memory 8MB and validate firmware/boot and signal integrity assumptions before production.
FAQ

Who is the manufacturer of TE0890-02-P1C-5-A?
Trenz Electronic GmbH

What Connector Type does TE0890-02-P1C-5-A have?
80 Pin

What is the Size / Dimension of TE0890-02-P1C-5-A?
2.047" L x 1.063" W (52.00mm x 27.00mm)

How is TE0890-02-P1C-5-A supplied (packaging)?
Bulk

Application Scenarios

In real deployments, trenz Electronic GmbH TE0890-02-P1C-5-A in the Microcontrollers, Microprocessor, FPGA Modules category is typically selected when engineers need predictable, spec-driven behavior in a production design. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Within automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. Across IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. This is why the following scenarios matter: they reflect the environmental and integration stresses that dominate outcomes. When integration risk is controlled early, downstream debugging effort drops and validation becomes easier to repeat.

Compatibility Advice
  • For second-source planning, verify clocking and startup behavior so the system does not enter undefined states during cold start and power cycling. This helps field behavior stay predictable across lots.
  • Check I/O voltage domains and protection so mixed-voltage interfaces do not degrade reliability over time before release to production.
Project Fit
  • Good fit when you can validate Trenz Electronic GmbH TE0890-02-P1C-5-A for Microcontrollers, Microprocessor, FPGA Modules integration in the final enclosure, and you care about predictable behavior across temperature and activity rather than fragile peak benchmarks.
  • Poor fit when boot and recovery behavior depends on sequencing and strapping that cannot be controlled across builds, because repeatable production verification is not feasible.
TE0890-02-P1C-5-ATE0890-02-P1C-5-A

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