TEC0850-03-15EG1E

TEC0850-03-15EG1E

  • Description:CMPT PCI SERIAL CRD ULTRASCALE
  • Series:Zynq® UltraScale+™

SKU:74c1ea3608b6 Category: Brand:

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Product Detailed Parameters

  • Description:CMPT PCI SERIAL CRD ULTRASCALE
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:Zynq UltraScale+ XCZU15EG-1FFVB1156E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:8GB
  • Connector Type:CompactPCI Serial Backplane
  • Size / Dimension:-
  • Operating Temperature:-

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TEC0850-03-15EG1E

Buying Guide
Summary

Trenz Electronic GmbH TEC0850-03-15EG1E is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (CMPT PCI SERIAL CRD ULTRASCALE), Core (Zynq UltraScale+ XCZU15EG-1FFVB1156E), and RAM (8GB).

Selection Notes
  • For TEC0850-03-15EG1E, confirm the program memory size (128MB) is sufficient for your firmware image and update plan.
  • Confirm Module/Board Type (MCU, FPGA) is suitable for your use case and operating conditions.
  • Make sure Connector Type (CompactPCI Serial Backplane) aligns with your design targets and verification plan.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Lock the mechanical constraints first (packaging Bulk) before comparing performance specs.
  • For MCU/memory substitutions, match memory 8GB and verify pin-mux, timing margins, and power sequencing.
  • To speed up alternate matching, share your must-have constraints (package/footprint, key ratings, interface) plus quantity and target date.
FAQ

What details help you quote TEC0850-03-15EG1E quickly?
Share the part number (TEC0850-03-15EG1E), quantity, target delivery date, and any packaging or documentation requirements.

Can you confirm the RAM Size for TEC0850-03-15EG1E?
8GB

What packaging is listed for TEC0850-03-15EG1E?
Bulk

What is the core processor of TEC0850-03-15EG1E?
Zynq UltraScale+ XCZU15EG-1FFVB1156E

Application Scenarios

Selecting Trenz Electronic GmbH TEC0850-03-15EG1E for Microcontrollers, Microprocessor, FPGA Modules usually comes down to meeting the system constraints that matter most: limits, interfaces, and testability in the real build. In practice, they commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In practice, within building automation, local compute keeps systems functional even when cloud connectivity is intermittent. In consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. Within smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • In practice, verify clocking and startup behavior so the system does not enter undefined states during cold start and power cycling during bring-up and production test.
Project Fit
  • A strong fit when you can bench-verify Trenz Electronic GmbH TEC0850-03-15EG1E for Microcontrollers, Microprocessor, FPGA Modules integration in the final enclosure, typically when you can provision programming and debug access so production test and field recovery are practical.
TEC0850-03-15EG1ETEC0850-03-15EG1E

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