U7004B-MFSG3

U7004B-MFSG3

  • Description:IC RF TXRX ISM>1GHZ 20SSO
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)

SKU:0e23b059ad09 Category: Brand:

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Product Detailed Parameters

  • Description:IC RF TXRX ISM>1GHZ 20SSO
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)
  • Type:TxRx Only
  • RF Family/Standard:General ISM > 1GHz
  • Protocol:-
  • Modulation:-
  • Frequency:1.9GHz
  • Data Rate (Max):-
  • Power - Output:26.5dBm
  • Sensitivity:-
  • Memory Size:-
  • Serial Interfaces:-
  • Voltage - Supply:2.7V ~ 4.6V
  • Current - Receiving:8mA
  • Current - Transmitting:450mA
  • Operating Temperature:-25°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:20-LSSOP (0.173", 4.40mm Width)
  • Supplier Device Package:20-SSO
  • GPIO:-
  • Grade:-
  • Qualification:-

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U7004B-MFSG3

Buying Guide
Summary

Microchip Technology U7004B-MFSG3 is used in RF Transceiver ICs category in RF signal paths where layout, grounding, and interface choices determine real performance. Key specs include Description (IC RF TXRX ISM>1GHZ 20SSO), Temperature (-25°C ~ 70°C), Package/case (20-LSSOP (0.173", 4.40mm Width)), Mounting (Surface Mount), and Packaging (Tape & Reel (TR)).

Selection Notes
  • For U7004B-MFSG3, confirm the operating frequency (1.9GHz) and any related tolerance requirements.
  • Verify the operating temperature range (-25°C ~ 70°C) and derate as needed in your application.
  • Validate Current - Transmitting (450mA) under the expected test conditions in your application.
  • Double-check the mounting type (Surface Mount) for your intended installation method.
Alternates & Substitutions
  • In RF Transceiver ICs designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • For substitutions, match the footprint-related items first: package/case 20-LSSOP (0.173", 4.40mm Width), supplier package 20-SSO, mounting Surface Mount.
  • Confirm the real operating corners (supply 2.7V ~ 4.6V, temperature -25°C ~ 70°C) and avoid swaps that only work at typical conditions.
  • For RF substitutions, match the operating band and interface, then validate insertion loss and return loss in your real signal path.
FAQ

Any tips for integrating U7004B-MFSG3 into an RF signal path?
Pay attention to impedance continuity, grounding, connector transitions, and layout symmetry to minimize loss and reflections.

What is the packaging of U7004B-MFSG3?
Tape & Reel (TR)

What Current - Transmitting is listed for U7004B-MFSG3?
450mA

What operating frequency does U7004B-MFSG3 run at?
1.9GHz

Application Scenarios

Within practice, the question for Microchip Technology U7004B-MFSG3 in RF Transceiver ICs is whether it stays inside the electrical/thermal envelope while remaining easy to validate and support. Selection usually balances margin, qualification evidence, availability, and how repeatable the tuning process is in production. Teams often favor RF parts with clear reference layouts and measured example designs, because layout determines whether the numbers are reachable. In practice, within aerospace and defense, RF designs prioritize predictable link margin and controlled emissions over long lifecycles. Across security and access control, RF performance under metal proximity and long cable runs determines reliability in real buildings. In point-of-sale and retail IoT, RF reliability matters in metal-heavy environments with dense Wi‑Fi and Bluetooth traffic.

Compatibility Advice
  • Confirm cable bend and routing constraints so strain relief is not treated as an afterthought during enclosure design during bring-up and production test.
  • In board-level integration, check insertion loss, group delay, and impedance behavior across temperature so link budgets stay stable. This helps field behavior stay predictable across lots.
Project Fit
  • Best fit for RF Transceiver ICs when you can validate impedance matching, shielding, and coexistence inside the final enclosure.
U7004B-MFSG3U7004B-MFSG3

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