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WP3160W6EFEI-320B1

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WP3160W6EFEI-320B1

WP3160W6EFEI-320B1

  • Description：WINPATH3 SLB 160 PROC 320MHZ
  • Series：-

SKU:6b20c14ad9f9 Category: Brand:

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Product Detailed Parameters

  • Description：WINPATH3 SLB 160 PROC 320MHZ
  • Series：-
  • Mfr：Microsemi Corporation
  • Package：Tray
  • Applications：Network Processor
  • Core Processor：MIPS32® 34Kc™
  • Program Memory Type：SRAM
  • Controller Series：-
  • RAM Size：-
  • Interface：I2C, RMII, UART
  • Number of I/O：-
  • Voltage - Supply：-
  • Operating Temperature：-
  • Mounting Type：Surface Mount
  • Package / Case：896-BGA, FCBGA
  • Supplier Device Package：896-FCBGA (31x31)
  • Grade：-
  • Qualification：-

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WP3160W6EFEI-320B1

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

Microsemi Corporation WP3160W6EFEI-320B1 is selected in Application Specific Microcontrollers category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (WINPATH3 SLB 160 PROC 320MHZ), Core (MIPS32® 34Kc™), Package/case (896-BGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For WP3160W6EFEI-320B1, double-check the mounting type (Surface Mount) for your intended installation method.
  • Double-check the data interface (I2C, RMII, UART) for integration and verification planning.
  • Make sure the package/case (896-BGA, FCBGA) is compatible with your footprint and pick-and-place setup.
Alternates & Substitutions
  • In Application Specific Microcontrollers, confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Begin with the constraints that are hardest to change later: package/case 896-BGA, FCBGA, supplier package 896-FCBGA (31x31), mounting Surface Mount.
  • For digital parts, align interface I2C, RMII, UART and validate firmware/boot and signal integrity assumptions before production.
  • If substitutions are likely, write down the non-negotiables and re-check them when the supply chain changes, not after field failures.
FAQ

What is the core processor of WP3160W6EFEI-320B1?
MIPS32® 34Kc™

Can you confirm the packaging for WP3160W6EFEI-320B1?
Tray

What package type does WP3160W6EFEI-320B1 come in?
896-BGA, FCBGA

Is WP3160W6EFEI-320B1 surface-mount or through-hole?
Surface Mount

Application Scenarios

In many Application Specific Microcontrollers builds, Microsemi Corporation WP3160W6EFEI-320B1 is reviewed for predictable behavior, supportability, and stable qualification evidence. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. Across medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. With interfaces and limits agreed, the next step is proving measured behavior on the real PCB and harness. It also makes bring-up and troubleshooting easier by keeping behavior aligned with what can be validated on the bench.

Compatibility Advice
  • For production stability, check that alternates preserve boot ROM behavior and critical peripherals, not only pin count and frequency. This avoids one-off tuning in production.
  • In practice, validate startup states and default pin configurations so connected peripherals do not enter unsafe modes at reset on the assembled PCB.
  • With the final enclosure and cabling, verify clock, debug, and programming access so production test and field recovery are practical. This keeps qualification evidence reproducible later.
Project Fit
  • Good fit when you can test and document Microsemi Corporation WP3160W6EFEI-320B1 for Application Specific Microcontrollers integration on the assembled PCB, and you need deterministic boot and recovery behavior and can validate it across power sequencing and resets.
  • Poor fit when debug and programming access is not practical, increasing field recovery risk, because the remaining risk is system-level and cannot be bounded by datasheet checks alone.
WP3160W6EFEI-320B1WP3160W6EFEI-320B1

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