XC56309VL100A

XC56309VL100A

  • Description:IC DSP 24BIT 100MHZ 196-MAPBGA
  • Series:DSP563xx

SKU:cbe268c77fbb Category: Brand:

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Product Detailed Parameters

  • Description:IC DSP 24BIT 100MHZ 196-MAPBGA
  • Series:DSP563xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Type:Fixed Point
  • Interface:Host Interface, SSI, SCI
  • Clock Rate:100MHz
  • Non-Volatile Memory:ROM (576B)
  • On-Chip RAM:24kB
  • Voltage - I/O:3.30V
  • Voltage - Core:3.30V
  • Operating Temperature:-40°C ~ 105°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:196-LBGA
  • Supplier Device Package:196-LBGA (15x15)
  • Grade:-
  • Qualification:-

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XC56309VL100A

Buying Guide
Summary

NXP USA Inc. XC56309VL100A is used in DSP (Digital Signal Processors) category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC DSP 24BIT 100MHZ 196-MAPBGA), Temperature (-40°C ~ 105°C (TJ)), Package/case (196-LBGA), and Mounting (Surface Mount).

Selection Notes
  • For XC56309VL100A, make sure the mounting type (Surface Mount) matches how the part will be installed and inspected.
  • Check that the operating frequency (100MHz) aligns with your system clocking plan.
  • Confirm the operating temperature range (-40°C ~ 105°C (TJ)) meets your deployment conditions.
  • Verify Non-Volatile Memory (ROM (576B)) matches your requirements and the datasheet test conditions.
Alternates & Substitutions
  • For DSP (Digital Signal Processors) substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Start by confirming the physical match (package/case 196-LBGA, supplier package 196-LBGA (15x15), mounting Surface Mount) so the swap does not create a footprint risk.
  • Verify the alternate stays within temperature -40°C ~ 105°C (TJ) across startup, load steps, and worst-case temperature.
  • For MCU/memory substitutions, match interface Host Interface, SSI, SCI and verify pin-mux, timing margins, and power sequencing.
FAQ

What details help you quote XC56309VL100A quickly?
Send the part number (XC56309VL100A), quantity, target delivery date, and any required packaging or documentation.

What operating temperature range does XC56309VL100A support?
-40°C ~ 105°C (TJ)

Which package/case is specified for XC56309VL100A?
196-LBGA

Which Interface is listed for XC56309VL100A?
Host Interface, SSI, SCI

Application Scenarios

NXP USA Inc. XC56309VL100A in the DSP (Digital Signal Processors) category is typically selected when engineers need predictable, spec-driven behavior in a production design. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Within consumer electronics, integration reduces BOM and speeds product iterations while maintaining stable user experience. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Within building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. After that, the focus becomes predictable bring-up and avoiding surprises during compliance and production ramp. Once the boundaries are clear, it becomes easier to judge fit in the target application and test it on real hardware.

Compatibility Advice
  • In qualification work, validate power rail sequencing and decoupling close to the pins so brownouts and erratic resets are avoided. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Good fit when you can validate NXP USA Inc. XC56309VL100A for DSP (Digital Signal Processors) integration with the real wiring and cabling, and you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
  • Poor fit when boot and recovery behavior depends on sequencing and strapping that cannot be controlled across builds, because repeatable production verification is not feasible.
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