XCF128XFTG64C

XCF128XFTG64C

  • Description:IC PROM SRL 128M GATE 64-FTBGA
  • Series:-
  • Mfr:AMD
  • Package:Tray

SKU:7cd429e2b614 Category: Brand:

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Product Detailed Parameters

  • Description:IC PROM SRL 128M GATE 64-FTBGA
  • Series:-
  • Mfr:AMD
  • Package:Tray
  • Programmable Type:In System Programmable
  • Memory Size:128Mb
  • Voltage - Supply:1.7V ~ 2V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:64-TBGA
  • Supplier Device Package:64-FTBGA (10x13)

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XCF128XFTG64C

Buying Guide
Summary

AMD XCF128XFTG64C is sourced in Configuration PROMs for FPGAs category when teams want clear constraints and a repeatable validation path. Key specs include Description (IC PROM SRL 128M GATE 64-FTBGA), Packaging (Tray), Supply (1.7V ~ 2V), Temperature (-40°C ~ 85°C), and Package/case (64-TBGA).

Selection Notes
  • For XCF128XFTG64C, validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
  • Make sure Programmable Type (In System Programmable) aligns with your design targets and verification plan.
  • Ensure the package/case (64-TBGA) and land pattern match your PCB layout before procurement.
  • Ensure the supply range (1.7V ~ 2V) is compatible with your power tree and tolerance budget.
Alternates & Substitutions
  • In Configuration PROMs for FPGAs designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Confirm the real operating corners (supply 1.7V ~ 2V, temperature -40°C ~ 85°C) and avoid swaps that only work at typical conditions.
  • Keep the assembly and footprint constraints consistent (package/case 64-TBGA, supplier package 64-FTBGA (10x13), mounting Surface Mount) to avoid a late PCB change.
  • For production substitutions, confirm traceability and documentation expectations so the alternate can be released cleanly.
FAQ

Who is the manufacturer of XCF128XFTG64C?
AMD

What should I compare when selecting an alternate for XCF128XFTG64C?
Compare footprint/pinout, key electrical limits, temperature range, and interface requirements, then validate under worst-case conditions.

Which package/case is specified for XCF128XFTG64C?
64-TBGA

Can you confirm the Memory Size for XCF128XFTG64C?
128Mb

Application Scenarios

In production Configuration PROMs for FPGAs builds, parts like AMD XCF128XFTG64C are shortlisted for predictable behavior, clear documentation, and stable supply. Within practice, designers prefer logic that is easy to validate and less sensitive to small layout and process differences. For interlocks and glue logic, deterministic propagation and stable thresholds reduce intermittent faults and hard-to-debug timing escapes. Across automotive modules, robust I/O conditioning reduces intermittent faults under vibration and harness noise. In mixed-voltage systems, level shifting and translation logic prevent bus contention and ensure interface compliance across different I/O standards. In safety systems, deterministic logic enforces interlocks and fault signaling even when the main controller is rebooting or overloaded. For most teams, reducing uncertainty early is what keeps bring-up and qualification on track. In practice, for volume builds, repeatable validation helps keep yield stable and reduces the probability of field-only corner cases.

Compatibility Advice
  • Before release to production, confirm memory interface timing and SI assumptions so firmware behavior stays stable across temperature and lot variation. This reduces the chance that substitutions push hidden limits.
Project Fit
  • Best fit for Configuration PROMs for FPGAs when you can validate timing margins, skew, and termination on the real routing so behavior is repeatable across temperature. Key checks often include configuration.
XCF128XFTG64CXCF128XFTG64C

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