XCZU9EG-2FFVB1156I

XCZU9EG-2FFVB1156I

$4,853.50
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:152c14a02f2f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:533MHz, 600MHz, 1.3GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

Download product information

XCZU9EG-2FFVB1156I

Buying Guide
Summary

AMD XCZU9EG-2FFVB1156I is used in System On Chip (SoC) category where integration and verification need to stay predictable. Key specs include Description (IC SOC CORTEX-A53 1156FCBGA), Series (Zynq® UltraScale+™ MPSoC EG), Packaging (Tray), Temperature (-40°C ~ 100°C (TJ)), and Package/case (1156-BBGA, FCBGA).

Selection Notes
  • For XCZU9EG-2FFVB1156I, make sure Primary Attributes (Zynq®UltraScale+™ FPGA, 599K+ Logic Cells) aligns with your design targets and verification plan.
  • Ensure the package/case (1156-BBGA, FCBGA) and land pattern match your PCB layout before procurement.
  • Validate the operating temperature range (-40°C ~ 100°C (TJ)) for your environment and margin.
  • Verify Architecture (MCU, FPGA) matches your requirements and the datasheet test conditions.
Alternates & Substitutions
  • In System On Chip (SoC), confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Confirm the physical match (package/case 1156-BBGA, FCBGA, supplier package 1156-FCBGA (35x35), packaging Tray) and the operating corners (temperature -40°C ~ 100°C (TJ)) so the substitution is not a hidden redesign.
  • For production substitutions, confirm traceability and documentation expectations so the alternate can be released cleanly.
  • Before approving a second source, compare the functional mode matrix and the test conditions behind the marketing headline specs.
FAQ

Who is the manufacturer of XCZU9EG-2FFVB1156I?
AMD

What should I verify before using XCZU9EG-2FFVB1156I in production?
Confirm footprint/pinout, min/max ratings, operating temperature, and the datasheet test conditions behind key specifications.

What RAM Size is listed for XCZU9EG-2FFVB1156I?
256KB

What package type does XCZU9EG-2FFVB1156I come in?
1156-BBGA, FCBGA

Application Scenarios

AMD XCZU9EG-2FFVB1156I is listed under the System On Chip (SoC) category and is commonly used when correctness, reliability, and qualification repeatability matter. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. Across categories, lowering integration uncertainty is what turns validation into a repeatable process. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Within building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. Across consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In real deployments, repeatability across temperature, load, and noise is what keeps performance consistent.

Compatibility Advice
  • For System On Chip (SoC) compatibility, validate boot/reset sequencing, power integrity, and timing margins on the assembled system. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Best fit for System On Chip (SoC) when you can validate boot/reset sequencing, power integrity, and timing margins across temperature and supply corners.
XCZU9EG-2FFVB1156IXCZU9EG-2FFVB1156I
$4,853.50
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