XCZU9EG-3FFVB1156E

XCZU9EG-3FFVB1156E

$5,914.94
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:34f0b1da9442 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.5GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

Download product information

XCZU9EG-3FFVB1156E

Buying Guide
Summary

AMD XCZU9EG-3FFVB1156E is used in System On Chip (SoC) category where integration and verification need to stay predictable. Key specs include Description (IC SOC CORTEX-A53 1156FCBGA), Series (Zynq® UltraScale+™ MPSoC EG), Packaging (Tray), Temperature (0°C ~ 100°C (TJ)), and Package/case (1156-BBGA, FCBGA).

Selection Notes
  • For XCZU9EG-3FFVB1156E, verify the package/case (1156-BBGA, FCBGA) fits your mechanical constraints and assembly process.
  • Validate the operating temperature range (0°C ~ 100°C (TJ)) for your environment and margin.
  • Verify Architecture (MCU, FPGA) matches your requirements and the datasheet test conditions.
Alternates & Substitutions
  • For System On Chip (SoC), treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Then confirm the operating envelope (temperature 0°C ~ 100°C (TJ)) with margin for transients and derating.
  • Confirm compliance/qualification needs (for example RoHS/REACH or grade) before approving a second source for production.
  • If substitutions are likely, write down the non-negotiables and re-check them when the supply chain changes, not after field failures.
FAQ

Can you confirm the Connectivity for XCZU9EG-3FFVB1156E?
CANbus, EBI/EMI, Ethernet, etc.

What is the packaging of XCZU9EG-3FFVB1156E?
Tray

What Supplier Device Package does XCZU9EG-3FFVB1156E have?
1156-FCBGA (35x35)

What is the Speed of XCZU9EG-3FFVB1156E?
600MHz, 1.5GHz

Application Scenarios

For AMD XCZU9EG-3FFVB1156E used in System On Chip (SoC) designs, the shortlist is often driven by predictable margins and a straightforward validation plan. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In real deployments, across building automation, local compute keeps systems functional even when cloud connectivity is intermittent. In consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • Validate power-domain assumptions and decoupling near the pins so brownouts and erratic behavior do not appear at temperature corners during bring-up and production test.
  • For compatibility, validate power-domain assumptions and decoupling near the pins so brownouts and erratic behavior do not appear at temperature corners during bring-up and production test.
Project Fit
  • A weaker fit when integrating AMD XCZU9EG-3FFVB1156E for System On Chip (SoC), boot and recovery behavior depends on sequencing or strapping that cannot be controlled across builds, because it becomes difficult to prove margin across production variance.
XCZU9EG-3FFVB1156EXCZU9EG-3FFVB1156E
$5,914.94
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