XCZU9EG-3FFVC900E

XCZU9EG-3FFVC900E

$5,234.94
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:6e24cb3adb1b Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.5GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

Download product information

XCZU9EG-3FFVC900E

Buying Guide
Summary

AMD XCZU9EG-3FFVC900E is used in System On Chip (SoC) category where integration and verification need to stay predictable. Key specs include Description (IC SOC CORTEX-A53 900FCBGA), Series (Zynq® UltraScale+™ MPSoC EG), Packaging (Tray), Temperature (0°C ~ 100°C (TJ)), and Package/case (900-BBGA, FCBGA).

Selection Notes
  • For XCZU9EG-3FFVC900E, confirm the operating temperature range (0°C ~ 100°C (TJ)) meets your deployment conditions.
  • Confirm Primary Attributes (Zynq®UltraScale+™ FPGA, 599K+ Logic Cells) meets your design constraints and system-level expectations.
  • Double-check the package/case (900-BBGA, FCBGA) and recommended land pattern before ordering.
  • Confirm Architecture (MCU, FPGA) is suitable for your use case and operating conditions.
Alternates & Substitutions
  • In System On Chip (SoC) designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Begin with the constraints that are hardest to change later: package/case 900-BBGA, FCBGA, supplier package 900-FCBGA (31x31), packaging Tray.
  • Confirm compliance/qualification needs (for example RoHS/REACH or grade) before approving a second source for production.
  • Always compare the datasheet test conditions behind key specs (load, frequency, temperature) to avoid swapping in a part that was characterized differently.
FAQ

What should I compare when selecting an alternate for XCZU9EG-3FFVC900E?
Compare footprint/pinout, key electrical limits, temperature range, and interface requirements, then validate under worst-case conditions.

What is the Primary Attributes of XCZU9EG-3FFVC900E?
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

What is the package/case of XCZU9EG-3FFVC900E?
900-BBGA, FCBGA

What is the packaging of XCZU9EG-3FFVC900E?
Tray

Application Scenarios

Across practice, the question for AMD XCZU9EG-3FFVC900E in System On Chip (SoC) is whether it stays inside the electrical/thermal envelope while remaining easy to validate and support. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. In real deployments, across industrial automation, controllers run deterministic logic and protocol stacks in EMI-heavy cabinets with dust and vibration. Across smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. In automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. With stable margins and a clear test plan, long-term support becomes more manageable.

Compatibility Advice
  • For System On Chip (SoC) compatibility, validate boot/reset sequencing, power integrity, and timing margins on the assembled system. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • A weaker fit when integrating AMD XCZU9EG-3FFVC900E for System On Chip (SoC), I/O voltage domains are uncertain, increasing long-term overstress and compatibility risk, because it becomes difficult to prove margin across production variance.
XCZU9EG-3FFVC900EXCZU9EG-3FFVC900E
$5,234.94
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