XCZU9EG-L1FFVB1156I

XCZU9EG-L1FFVB1156I

$4,246.81
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:248b377605fe Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Bulk
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

Download product information

XCZU9EG-L1FFVB1156I

Buying Guide
Summary

AMD XCZU9EG-L1FFVB1156I is sourced in System On Chip (SoC) category when teams want clear constraints and a repeatable validation path. Key specs include Description (IC SOC CORTEX-A53 1156FCBGA), Series (Zynq® UltraScale+™ MPSoC EG), Packaging (Bulk), Temperature (-40°C ~ 100°C (TJ)), and Package/case (1156-BBGA, FCBGA).

Selection Notes
  • For XCZU9EG-L1FFVB1156I, verify the operating temperature range (-40°C ~ 100°C (TJ)) and derate as needed in your application.
  • Double-check Architecture (MCU, FPGA) against your specification and operating conditions.
  • Make sure the package/case (1156-BBGA, FCBGA) is compatible with your footprint and pick-and-place setup.
Alternates & Substitutions
  • For System On Chip (SoC) substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Treat package/case 1156-BBGA, FCBGA, supplier package 1156-FCBGA (35x35), packaging Bulk as the first filter, then move on to electrical and performance checks.
  • If you are qualifying a second source, align documentation/traceability requirements early to avoid surprises in procurement.
  • If you already have candidate alternates, send the list and we can check drop-in risks against (package 1156-BBGA, FCBGA).
FAQ

Who is the manufacturer of XCZU9EG-L1FFVB1156I?
AMD

What Speed does XCZU9EG-L1FFVB1156I have?
500MHz, 600MHz, 1.2GHz

What Peripherals is listed for XCZU9EG-L1FFVB1156I?
DMA, WDT

Which operating temperature range is specified for XCZU9EG-L1FFVB1156I?
-40°C ~ 100°C (TJ)

Application Scenarios

Across practice, the question for AMD XCZU9EG-L1FFVB1156I in System On Chip (SoC) is whether it stays inside the electrical/thermal envelope while remaining easy to validate and support. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In practice, at that point, a small set of targeted tests often reveals whether the design is robust or just looks good under typical bench conditions. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. In building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. A clear validation path helps reduce churn during bring-up and avoids late surprises during compliance work.

Compatibility Advice
  • In practice, plan debug and production test access early so firmware loading, boundary checks, and fault recovery are repeatable on the assembled PCB.
  • For production stability, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds with the final enclosure and cabling.
Project Fit
  • Works best when you can verify AMD XCZU9EG-L1FFVB1156I for System On Chip (SoC) integration across temperature and supply corners, when you can control power sequencing and decoupling so brownouts and erratic resets are avoided.
  • More fragile when integrating AMD XCZU9EG-L1FFVB1156I for System On Chip (SoC), debug and programming access is not practical, increasing field recovery risk, because integration risk stays high when key margins cannot be measured.
XCZU9EG-L1FFVB1156IXCZU9EG-L1FFVB1156I
$4,246.81
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