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XCZU9EG-L1FFVC900I

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XCZU9EG-L1FFVC900I

XCZU9EG-L1FFVC900I

$3,758.06
  • Description：IC SOC CORTEX-A53 900FCBGA
  • Series：Zynq® UltraScale+™ MPSoC EG

SKU:1da23f2152fb Category: Brand:

　　
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Product Detailed Parameters

  • Description：IC SOC CORTEX-A53 900FCBGA
  • Series：Zynq® UltraScale+™ MPSoC EG
  • Mfr：AMD
  • Package：Tray
  • Architecture：MCU, FPGA
  • Core Processor：Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size：-
  • RAM Size：256KB
  • Peripherals：DMA, WDT
  • Connectivity：CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed：500MHz, 600MHz, 1.2GHz
  • Primary Attributes：Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature：-40°C ~ 100°C (TJ)
  • Package / Case：900-BBGA, FCBGA
  • Supplier Device Package：900-FCBGA (31x31)

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XCZU9EG-L1FFVC900I

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

AMD XCZU9EG-L1FFVC900I is a component in System On Chip (SoC) category typically evaluated for fit, operating limits, and supportability in production. Key specs include Description (IC SOC CORTEX-A53 900FCBGA), Series (Zynq® UltraScale+™ MPSoC EG), Packaging (Tray), Temperature (-40°C ~ 100°C (TJ)), and Package/case (900-BBGA, FCBGA).

Selection Notes
  • For XCZU9EG-L1FFVC900I, verify the operating temperature range (-40°C ~ 100°C (TJ)) and derate as needed in your application.
  • Verify Architecture (MCU, FPGA) and compare it against your reference design limits.
  • Make sure the package/case (900-BBGA, FCBGA) is compatible with your footprint and pick-and-place setup.
Alternates & Substitutions
  • For System On Chip (SoC), compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • For any substitution, verify the datasheet conditions behind headline specs and validate the alternate under your worst-case operating corners.
  • Check that temperature -40°C ~ 100°C (TJ) matches your system, then validate at corners instead of relying on typical values.
  • When in doubt, treat the swap as an ECO: define acceptance criteria, then validate under worst-case operating corners.
FAQ

What should I compare when selecting an alternate for XCZU9EG-L1FFVC900I?
Compare footprint/pinout, key electrical limits, temperature range, and interface requirements, then validate under worst-case conditions.

Can you confirm the Peripherals for XCZU9EG-L1FFVC900I?
DMA, WDT

What package/case does XCZU9EG-L1FFVC900I use?
900-BBGA, FCBGA

Which operating temperature range is specified for XCZU9EG-L1FFVC900I?
-40°C ~ 100°C (TJ)

Application Scenarios

AMD XCZU9EG-L1FFVC900I is a common choice in System On Chip (SoC) applications where the goal is to keep validation repeatable and avoid edge-case surprises during bring-up. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Across IoT deployments, low power and secure boot support long-life outdoor operation. Across automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability.

Compatibility Advice
  • For AMD XCZU9EG-L1FFVC900I in System On Chip (SoC), validate boot/reset sequencing, power integrity, and timing margins on the assembled system. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Usually not a good fit when integrating AMD XCZU9EG-L1FFVC900I for System On Chip (SoC), I/O voltage domains are uncertain, increasing long-term overstress and compatibility risk, because the integration depends on constraints that cannot be controlled across builds.
  • Best fit when you can measure and verify AMD XCZU9EG-L1FFVC900I for System On Chip (SoC) integration with production-like fixtures, especially if you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
XCZU9EG-L1FFVC900IXCZU9EG-L1FFVC900I
$3,758.06
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