XP1001000M-05R

XP1001000M-05R

$47.86
  • Description:IC MOD DSTNI-EX 25MHZ 256KB
  • Series:XPort®

SKU:bf95c198e385 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC MOD DSTNI-EX 25MHZ 256KB
  • Series:XPort®
  • Mfr:Lantronix, Inc.
  • Package:Tray
  • Module/Board Type:MPU Core
  • Core Processor:DSTni-EX
  • Co-Processor:XPort AR
  • Speed:25MHz
  • Flash Size:512KB
  • RAM Size:256KB
  • Connector Type:RJ45
  • Size / Dimension:0.570" L x 0.720" W (14.50mm x 18.30mm)
  • Operating Temperature:-40°C ~ 85°C

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XP1001000M-05R

Buying Guide
Summary

Lantronix, Inc. XP1001000M-05R is selected in Microcontrollers, Microprocessor, FPGA Modules category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MOD DSTNI-EX 25MHZ 256KB), Core (DSTni-EX), Speed (25MHz), RAM (256KB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For XP1001000M-05R, verify the available flash/program memory (512KB) matches your code size and feature roadmap.
  • Confirm the operating temperature range (-40°C ~ 85°C) meets your deployment conditions.
  • Confirm Connector Type (RJ45) and ensure it matches your integration requirements.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, validate alternates under worst-case corners rather than assuming typical-only conditions represent production builds.
  • Start by confirming the physical match (packaging Tray) so the swap does not create a footprint risk.
  • Validate the min/max operating conditions (temperature -40°C ~ 85°C) and keep headroom for worst-case corners.
  • For MCU/memory substitutions, match speed 25MHz, memory 256KB and verify pin-mux, timing margins, and power sequencing.
FAQ

What details help you quote XP1001000M-05R quickly?
Share the part number (XP1001000M-05R), quantity, target delivery date, and any packaging or documentation requirements.

Which Co-Processor is listed for XP1001000M-05R?
XPort AR

Can you confirm the RAM Size for XP1001000M-05R?
256KB

Which Flash Size is specified for XP1001000M-05R?
512KB

Application Scenarios

Lantronix, Inc. XP1001000M-05R in the Microcontrollers, Microprocessor, FPGA Modules category is typically selected when engineers need predictable, spec-driven behavior in a production design. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. In production builds, the emphasis shifts to repeatable testing, predictable failure modes, and stable behavior across lots. As a result, qualification becomes easier to repeat and less sensitive to lot-to-lot variation.

Compatibility Advice
  • Validate that alternate parts preserve boot modes, memory interfaces, and critical timing assumptions rather than only pinout on the assembled PCB.
  • Confirm memory interface timing and SI assumptions so firmware behavior stays stable across temperature and lot variation with the final enclosure and cabling.
Project Fit
  • Good fit when you can qualify Lantronix, Inc. XP1001000M-05R for Microcontrollers, Microprocessor, FPGA Modules integration with the real wiring and cabling, and you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
  • Poor fit when power-domain and decoupling constraints cannot be validated, increasing erratic reset risk, because the integration depends on constraints that cannot be controlled across builds.
XP1001000M-05RXP1001000M-05R
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