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XPP100200S-02R

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— IC芯片 | 连接器 | 传感器 | 被动器件 —

XPP100200S-02R

XPP100200S-02R

$59.91
  • Description：IC MODULE IPV6 16MB
  • Series：XPort® Pro

SKU:4548cd879d63 Category: Brand:

　　
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Product Detailed Parameters

  • Description：IC MODULE IPV6 16MB
  • Series：XPort® Pro
  • Mfr：Lantronix, Inc.
  • Package：Box
  • Module/Board Type：MPU Core
  • Core Processor：IPv6
  • Co-Processor：XPort® Pro
  • Speed：-
  • Flash Size：16MB
  • RAM Size：16MB
  • Connector Type：RJ45
  • Size / Dimension：0.630" L x 1.330" W (16.00mm x 33.90mm)
  • Operating Temperature：-40°C ~ 85°C

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XPP100200S-02R

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

Lantronix, Inc. XPP100200S-02R is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MODULE IPV6 16MB), Core (IPv6), RAM (16MB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For XPP100200S-02R, confirm the program memory size (16MB) is sufficient for your firmware image and update plan.
  • Validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
  • Confirm Size / Dimension (0.630" L x 1.330" W (16.00mm x 33.90mm)) meets your design constraints and system-level expectations.
  • Verify Connector Type (RJ45) matches your requirements and the datasheet test conditions.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Before looking at performance tables, lock packaging Box and verify the system envelope (temperature -40°C ~ 85°C) to avoid a non-drop-in swap.
  • For MCU/memory substitutions, match memory 16MB and verify pin-mux, timing margins, and power sequencing.
  • If you need alternates, provide your key constraints (footprint, electrical limits, interface) and we can suggest options for evaluation.
FAQ

Any tips for migrating firmware to XPP100200S-02R?
Confirm pin functions, peripheral differences, timing assumptions, and memory layout, then validate under worst-case operating conditions.

What is the Flash Size of XPP100200S-02R?
16MB

Which packaging format is listed for XPP100200S-02R?
Box

Which Module/Board Type is specified for XPP100200S-02R?
MPU Core

Application Scenarios

In many Microcontrollers, Microprocessor, FPGA Modules builds, Lantronix, Inc. XPP100200S-02R is reviewed for predictable behavior, supportability, and stable qualification evidence. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. In consumer electronics, integration reduces BOM and speeds product iterations while maintaining stable user experience. Within medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Across building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent.

Compatibility Advice
  • For Lantronix, Inc. XPP100200S-02R in Microcontrollers, Microprocessor, FPGA Modules, validate boot/reset sequencing, power integrity, and timing margins on the assembled system. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Best fit for Microcontrollers, Microprocessor, FPGA Modules when you can validate boot/reset sequencing, power integrity, and timing margins across temperature and supply corners.
XPP100200S-02RXPP100200S-02R
$59.91
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