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XPP100300S-04R

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— IC芯片 | 连接器 | 传感器 | 被动器件 —

XPP100300S-04R

XPP100300S-04R

$63.16
  • Description：IC MODULE IPV6 16MB
  • Series：XPort® Pro

SKU:96adacfcc385 Category: Brand:

　　
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Product Detailed Parameters

  • Description：IC MODULE IPV6 16MB
  • Series：XPort® Pro
  • Mfr：Lantronix, Inc.
  • Package：Bulk
  • Module/Board Type：MPU Core
  • Core Processor：IPv6
  • Co-Processor：XPort® Pro
  • Speed：-
  • Flash Size：16MB
  • RAM Size：16MB
  • Connector Type：RJ45
  • Size / Dimension：0.630" L x 1.330" W (16.00mm x 33.90mm)
  • Operating Temperature：-40°C ~ 85°C

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XPP100300S-04R

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

Lantronix, Inc. XPP100300S-04R is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MODULE IPV6 16MB), Core (IPv6), RAM (16MB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For XPP100300S-04R, validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
  • Confirm Size / Dimension (0.630" L x 1.330" W (16.00mm x 33.90mm)) is suitable for your use case and operating conditions.
  • Confirm the program memory size (16MB) is sufficient for your firmware image and update plan.
  • Confirm Co-Processor (XPort® Pro) is suitable for your use case and operating conditions.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, validate alternates under worst-case corners rather than assuming typical-only conditions represent production builds.
  • Validate the min/max operating conditions (temperature -40°C ~ 85°C) and keep headroom for worst-case corners.
  • Start by confirming the physical match (packaging Bulk) so the swap does not create a footprint risk.
  • For MCU/memory substitutions, match memory 16MB and verify pin-mux, timing margins, and power sequencing.
FAQ

Who is the manufacturer of XPP100300S-04R?
Lantronix, Inc.

What are common selection points for a microcontroller like XPP100300S-04R?
Check flash/RAM headroom, peripheral set, connectivity options, package constraints, and availability for your production horizon.

Can you confirm the Size / Dimension for XPP100300S-04R?
0.630" L x 1.330" W (16.00mm x 33.90mm)

What is the Co-Processor of XPP100300S-04R?
XPort® Pro

Application Scenarios

Selecting Lantronix, Inc. XPP100300S-04R for Microcontrollers, Microprocessor, FPGA Modules usually comes down to meeting the system constraints that matter most: limits, interfaces, and testability in the real build. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. Across building automation, local compute keeps systems functional even when cloud connectivity is intermittent. Across consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. Within smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • In practice, verify clocking and startup behavior so the system does not enter undefined states during cold start and power cycling before release to production.
Project Fit
  • A strong fit when you can validate Lantronix, Inc. XPP100300S-04R for Microcontrollers, Microprocessor, FPGA Modules integration with the real wiring and cabling, typically when you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
  • Not ideal when integrating Lantronix, Inc. XPP100300S-04R for Microcontrollers, Microprocessor, FPGA Modules, debug and programming access is not practical, increasing field recovery risk, because validation would rely on assumptions that cannot be re-tested later.
XPP100300S-04RXPP100300S-04R
$63.16
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