XPP100400S-02R

XPP100400S-02R

$52.41
  • Description:IC MODULE IPV6 16MB
  • Series:XPort® Pro

SKU:6c1d43108f0a Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MODULE IPV6 16MB
  • Series:XPort® Pro
  • Mfr:Lantronix, Inc.
  • Package:Box
  • Module/Board Type:MPU Core
  • Core Processor:IPv6
  • Co-Processor:XPort® Pro Lx6
  • Speed:-
  • Flash Size:16MB
  • RAM Size:16MB
  • Connector Type:RJ45
  • Size / Dimension:0.630" L x 1.330" W (16.00mm x 33.90mm)
  • Operating Temperature:-40°C ~ 85°C

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XPP100400S-02R

Buying Guide
Summary

Lantronix, Inc. XPP100400S-02R is selected in Microcontrollers, Microprocessor, FPGA Modules category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MODULE IPV6 16MB), Core (IPv6), RAM (16MB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For XPP100400S-02R, make sure Module/Board Type (MPU Core) aligns with your design targets and verification plan.
  • Check program memory (16MB) for bootloader, diagnostics, and future headroom.
  • Verify the operating temperature range (-40°C ~ 85°C) and derate as needed in your application.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Always compare the datasheet test conditions behind key specs (load, frequency, temperature) to avoid swapping in a part that was characterized differently.
  • Make sure the alternate stays inside your system envelope: temperature -40°C ~ 85°C.
  • For digital parts, align memory 16MB and validate firmware/boot and signal integrity assumptions before production.
FAQ

Any tips for migrating firmware to XPP100400S-02R?
Confirm pin functions, peripheral differences, timing assumptions, and memory layout, then validate under worst-case operating conditions.

What Flash Size is listed for XPP100400S-02R?
16MB

How is XPP100400S-02R packaged?
Box

Which Module/Board Type is listed for XPP100400S-02R?
MPU Core

Application Scenarios

For Lantronix, Inc. XPP100400S-02R used in Microcontrollers, Microprocessor, FPGA Modules designs, the shortlist is often driven by predictable margins and a straightforward validation plan. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In industrial automation, controllers run deterministic logic and protocol stacks in EMI-heavy cabinets with dust and vibration. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. Within automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. In practice, disciplined selection and verification reduce integration risk and improve field reliability.

Compatibility Advice
  • Validate startup states and default pin configurations so connected peripherals do not enter unsafe modes at reset before freezing the BOM.
  • For compatibility, validate power rail sequencing and decoupling close to the pins so brownouts and erratic resets are avoided. This avoids one-off tuning in production.
Project Fit
  • Strongest fit when you can measure and verify Lantronix, Inc. XPP100400S-02R for Microcontrollers, Microprocessor, FPGA Modules integration with production-like fixtures, and you can provision programming and debug access so production test and field recovery are practical.
  • Riskier when integrating Lantronix, Inc. XPP100400S-02R for Microcontrollers, Microprocessor, FPGA Modules, programming and debug access are not practical, increasing field recovery risk, because the remaining risk is system-level and cannot be bounded by datasheet checks alone.
XPP100400S-02RXPP100400S-02R
$52.41
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