XZFVG05C2

XZFVG05C2

  • Description:DISPLAY 7SEG 0.2" DBL GRN 20SMD
  • Series:-
  • Mfr:SunLED
  • Package:Tape & Reel (TR)

SKU:a51396b58766 Category: Brand:

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Product Detailed Parameters

  • Description:DISPLAY 7SEG 0.2" DBL GRN 20SMD
  • Series:-
  • Mfr:SunLED
  • Package:Tape & Reel (TR)
  • Number of Characters:2
  • Size / Dimension:0.315" H x 0.555" W x 0.118" D (8.00mm x 14.10mm x 3.00mm)
  • Digit/Alpha Size:0.20" (5.08mm)
  • Display Type:7-Segment
  • Common Pin:Common Cathode
  • Color:Green
  • Voltage - Forward (Vf) (Typ):2V
  • Current - Test:10mA
  • Millicandela Rating:4mcd
  • Wavelength - Peak:574nm
  • Power Dissipation (Max):75mW
  • Package / Case:20-SMD, No Lead
  • Display Format:-

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XZFVG05C2

Buying Guide
Summary

SunLED XZFVG05C2 is an electronic component in LED Character and Numeric category. Key specs: description: DISPLAY 7SEG 0.2" DBL GRN 20SMD; packaging: Tape & Reel (TR); package/case: 20-SMD, No Lead.

Selection Notes
  • For XZFVG05C2, confirm package/case 20-SMD, No Lead to ensure footprint compatibility.
  • For XZFVG05C2, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (packaging Tape & Reel (TR); package/case 20-SMD, No Lead).
  • For XZFVG05C2, if this is for production, consider sourcing and lifecycle risk (second source / availability) (packaging Tape & Reel (TR); package/case 20-SMD, No Lead).
FAQ

What information do you need to quote XZFVG05C2?
Send the part number (XZFVG05C2), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for XZFVG05C2?
SunLED

What is the package/case of XZFVG05C2?
20-SMD, No Lead

What is the supply current of XZFVG05C2?
10mA

Application Scenarios
SunLED XZFVG05C2 is listed under the LED Character and Numeric category and is commonly used when correctness, reliability, and qualification repeatability matter. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. In networking hardware, specialized parts reduce re-spin risk by providing proven behavior in dense racks. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it strengthens system robustness by aligning electrical, thermal, and mechanical constraints with real deployment conditions.
XZFVG05C2XZFVG05C2

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