XZTNI45S-9

XZTNI45S-9

$0.13
  • Description:3.5X2.8MM IR REV. MOUNT SMD LED
  • Series:-
  • Mfr:SunLED
  • Package:Tape & Reel (TR)

SKU:4610cd24531c Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:3.5X2.8MM IR REV. MOUNT SMD LED
  • Series:-
  • Mfr:SunLED
  • Package:Tape & Reel (TR)
  • Current - DC Forward (If) (Max):50mA
  • Radiant Intensity (Ie) Min @ If:1.6mW/sr @ 50mA
  • Wavelength:940nm
  • Voltage - Forward (Vf) (Typ):1.2V
  • Viewing Angle:120°
  • Orientation:Top View
  • Operating Temperature:-40°C ~ 85°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:2-SMD, Gull Wing
  • Type:Infrared (IR)

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XZTNI45S-9

Buying Guide
Summary

SunLED XZTNI45S-9 is an electronic component in LED Emitters - Infrared, UV, Visible category. Key specs: description: 3.5X2.8MM IR REV. MOUNT SMD LED; type: Infrared (IR); packaging: Tape & Reel (TR); temperature: -40°C ~ 85°C; package/case: 2-SMD, Gull Wing; mounting: Surface Mount.

Selection Notes
  • For XZTNI45S-9, confirm package/case 2-SMD, Gull Wing, mounting Surface Mount to ensure footprint compatibility.
  • For XZTNI45S-9, validate the operating temperature range (-40°C ~ 85°C) against your environment.
  • For XZTNI45S-9, if this is for production, consider sourcing and lifecycle risk (second source / availability) (packaging Tape & Reel (TR); temperature -40°C ~ 85°C).
FAQ

How can I request a quote for XZTNI45S-9?
Send the part number (XZTNI45S-9), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for XZTNI45S-9?
SunLED

What is the supply current of XZTNI45S-9?
50mA

What is the packaging of XZTNI45S-9?
Tape & Reel (TR)

Application Scenarios
In the LED Emitters - Infrared, UV, Visible category, SunLED XZTNI45S-9 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. A good selection improves integration speed and lowers lifecycle risk. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it improves predictability by keeping key performance stable across manufacturing variance and operating conditions.
XZTNI45S-9XZTNI45S-9
$0.13
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