XZTNI53W

XZTNI53W

  • Description:EMITTER IR 940NM 50MA 0603
  • Series:-
  • Mfr:SunLED
  • Package:Tape & Reel (TR)

SKU:b60bfdb5761b Category: Brand:

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Product Detailed Parameters

  • Description:EMITTER IR 940NM 50MA 0603
  • Series:-
  • Mfr:SunLED
  • Package:Tape & Reel (TR)
  • Current - DC Forward (If) (Max):50mA
  • Radiant Intensity (Ie) Min @ If:0.8mW/sr @ 20mA
  • Wavelength:940nm
  • Voltage - Forward (Vf) (Typ):1.2V
  • Viewing Angle:120°
  • Orientation:Top View
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:0603 (1608 Metric)
  • Type:Infrared (IR)

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XZTNI53W

Buying Guide
Summary

SunLED XZTNI53W is an electronic component in LED Emitters - Infrared, UV, Visible category. Key specs: description: EMITTER IR 940NM 50MA 0603; type: Infrared (IR); packaging: Tape & Reel (TR); temperature: -40°C ~ 85°C (TA); package/case: 0603 (1608 Metric); mounting: Surface Mount.

Selection Notes
  • For XZTNI53W, confirm package/case 0603 (1608 Metric), mounting Surface Mount to ensure footprint compatibility.
  • For XZTNI53W, validate the operating temperature range (-40°C ~ 85°C (TA)) against your environment.
  • For XZTNI53W, confirm packaging option and moisture sensitivity handling if your assembly process requires it (temperature -40°C ~ 85°C (TA); package/case 0603 (1608 Metric)).
FAQ

What should I provide for an accurate quote for XZTNI53W?
Send the part number (XZTNI53W), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for XZTNI53W?
SunLED

What is the supply current of XZTNI53W?
50mA

What is the packaging of XZTNI53W?
Tape & Reel (TR)

Application Scenarios
SunLED XZTNI53W is listed under the LED Emitters - Infrared, UV, Visible category and is commonly used when correctness, reliability, and qualification repeatability matter. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. In networking hardware, specialized parts reduce re-spin risk by providing proven behavior in dense racks. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it strengthens system robustness by aligning electrical, thermal, and mechanical constraints with real deployment conditions.
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