ZL88701LDF1

ZL88701LDF1

$5.77
  • Description:IC TELECOM INTERFACE 64QFN
  • Series:-

SKU:9596c59d3c00 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC TELECOM INTERFACE 64QFN
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)
  • Function:Telecom Circuit
  • Interface:PCM
  • Number of Circuits:1
  • Voltage - Supply:3.135V ~ 3.465V
  • Current - Supply:-
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:64-VFQFN Exposed Pad
  • Supplier Device Package:64-QFN (9x9)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

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ZL88701LDF1

Buying Guide
Summary

Microchip Technology ZL88701LDF1 is used in Telecom category where integration and verification need to stay predictable. Key specs include Description (IC TELECOM INTERFACE 64QFN), Packaging (Tape & Reel (TR)), Supply (3.135V ~ 3.465V), Temperature (-40°C ~ 85°C), and Package/case (64-VFQFN Exposed Pad).

Selection Notes
  • For ZL88701LDF1, confirm the data interface (PCM) matches your host interface and timing requirements.
  • Validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
  • Check Number of Circuits (1) against the datasheet conditions and your system-level constraints.
  • Ensure the package/case (64-VFQFN Exposed Pad) and land pattern match your PCB layout before procurement.
Alternates & Substitutions
  • For Telecom substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Verify the alternate stays within supply 3.135V ~ 3.465V, temperature -40°C ~ 85°C across startup, load steps, and worst-case temperature.
  • When evaluating alternates, treat package/case 64-VFQFN Exposed Pad, supplier package 64-QFN (9x9), mounting Surface Mount as non-negotiable unless you are re-spinning the PCB.
  • When in doubt, treat the swap as an ECO: define acceptance criteria, then validate under worst-case operating corners.
FAQ

How do I confirm compatibility for ZL88701LDF1?
Match mechanical footprint first, then verify electrical limits and operating conditions against your system constraints.

Can you confirm the mounting type for ZL88701LDF1?
Surface Mount

Which supply voltage range is specified for ZL88701LDF1?
3.135V ~ 3.465V

What temperature range is listed for ZL88701LDF1?
-40°C ~ 85°C

Application Scenarios

Within production Telecom builds, parts like Microchip Technology ZL88701LDF1 are shortlisted for predictable behavior, clear documentation, and stable supply. In practice, return paths and coupling decide outcomes, so designers treat placement, shielding, and grounding as first-class requirements. Selection usually balances margin, qualification evidence, availability, and how repeatable the tuning process is in production. Within medical telemetry, controlled emissions and stable links are prioritized around sensitive instruments. Within IoT gateways, matching and filtering improve sensitivity and coexistence in crowded 2.4 GHz and sub-GHz environments. In aerospace telemetry, predictable RF routing and isolation improve resilience to interference and maintain link margin over long distances. In real deployments, across industrial sensing, RF front ends support radar and presence detection where phase noise and filtering influence range accuracy.

Compatibility Advice
  • On the assembled PCB, follow reference layouts and keep return paths continuous, because small routing changes can shift spurs and sensitivity. This keeps acceptance criteria measurable and repeatable.
  • For compatibility, confirm the frequency plan and filtering approach, including coexistence with nearby radios and digital clocks. This keeps qualification evidence reproducible later.
  • To avoid late surprises, verify supply cleanliness and grounding near the RF block, because conducted noise often shows up as desense or emissions. This avoids one-off tuning in production.
Project Fit
  • Good fit when you can bench-verify Microchip Technology ZL88701LDF1 for Telecom integration with the real wiring and cabling, and you can provide clean supplies and stable grounding near the RF block.
  • Poor fit when the enclosure and routing cannot be controlled enough to keep margins stable, because integration risk stays high when key margins cannot be measured.
ZL88701LDF1ZL88701LDF1
$5.77
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