ZSSC3218BI3R

ZSSC3218BI3R

$4.59
  • Description:IC INTFACE SPECIALIZED SGNL COND
  • Series:-

SKU:fa65a0eaa5fb Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC INTFACE SPECIALIZED SGNL COND
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:Sensor Signal Conditioner - Resistive
  • Interface:I2C, SPI
  • Voltage - Supply:1.68V ~ 3.6V
  • Package / Case:24-VFQFN Exposed Pad
  • Supplier Device Package:24-QFN (4x4)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount

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ZSSC3218BI3R

Buying Guide
Summary

Renesas Electronics Corporation ZSSC3218BI3R is an electronic component in Specialized category. Key specs: description: IC INTFACE SPECIALIZED SGNL COND; packaging: Tape & Reel (TR),Cut Tape (CT); supply: 1.68V ~ 3.6V; package/case: 24-VFQFN Exposed Pad; mounting: Surface Mount.

Selection Notes
  • For ZSSC3218BI3R, confirm package/case 24-VFQFN Exposed Pad, mounting Surface Mount to ensure footprint compatibility.
  • For ZSSC3218BI3R, check the supply voltage requirement (1.68V ~ 3.6V) and any rail tolerance constraints.
  • For ZSSC3218BI3R, review the latest datasheet revision and confirm key electrical characteristics for your use case (packaging Tape & Reel (TR),Cut Tape (CT); supply 1.68V ~ 3.6V).
FAQ

What should I provide for an accurate quote for ZSSC3218BI3R?
Send the part number (ZSSC3218BI3R), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for ZSSC3218BI3R?
Renesas Electronics Corporation

What is the packaging of ZSSC3218BI3R?
Tape & Reel (TR),Cut Tape (CT)

What is the package/case of ZSSC3218BI3R?
24-VFQFN Exposed Pad

Application Scenarios
For Renesas Electronics Corporation ZSSC3218BI3R in the Specialized category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They provide a focused function that reduces system integration risk and helps meet requirements in real deployments. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it strengthens system robustness by aligning electrical, thermal, and mechanical constraints with real deployment conditions.
ZSSC3218BI3RZSSC3218BI3R
$4.59
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