ZSSC4151AE2R

ZSSC4151AE2R

$4.61
  • Description:IC INTERFACE SPECIALIZED 24QFN
  • Series:-

SKU:f0ab2410d8eb Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC INTERFACE SPECIALIZED 24QFN
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:Sensor Signal Conditioner - Resistive
  • Interface:I2C, ZACwire™
  • Voltage - Supply:4.5V ~ 5.5V
  • Package / Case:24-VFQFN Exposed Pad
  • Supplier Device Package:24-QFN (4x4)
  • Grade:Automotive
  • Qualification:AEC-Q100
  • Mounting Type:Surface Mount

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ZSSC4151AE2R

Buying Guide
Summary

Renesas Electronics Corporation ZSSC4151AE2R is an electronic component in Specialized category. Key specs: description: IC INTERFACE SPECIALIZED 24QFN; packaging: Tape & Reel (TR),Cut Tape (CT); supply: 4.5V ~ 5.5V; package/case: 24-VFQFN Exposed Pad; mounting: Surface Mount.

Selection Notes
  • For ZSSC4151AE2R, confirm package/case 24-VFQFN Exposed Pad, mounting Surface Mount to ensure footprint compatibility.
  • For ZSSC4151AE2R, check the supply voltage requirement (4.5V ~ 5.5V) and any rail tolerance constraints.
  • For ZSSC4151AE2R, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (packaging Tape & Reel (TR),Cut Tape (CT); supply 4.5V ~ 5.5V).
FAQ

What information do you need to quote ZSSC4151AE2R?
Send the part number (ZSSC4151AE2R), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for ZSSC4151AE2R?
Renesas Electronics Corporation

What is the package/case of ZSSC4151AE2R?
24-VFQFN Exposed Pad

What is the mounting type of ZSSC4151AE2R?
Surface Mount

Application Scenarios
For Renesas Electronics Corporation ZSSC4151AE2R in the Specialized category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They provide a focused function that reduces system integration risk and helps meet requirements in real deployments. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
ZSSC4151AE2RZSSC4151AE2R
$4.61
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