SEARCH
— 葡萄酒 | 威士忌 | 白兰地 | 啤酒 —
The trend of science and technology is changing rapidly.
Recently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and development.
On October 9, 2025, Intel officially announced the launch of its first personal computer chip based on the 18A process technology – Panther Lake. This marks another significant breakthrough for Intel in advanced process technology and is expected to enhance its competitiveness in the PC chip market.
During an interview on October 9, Dr. Lisa Su, the CEO of AMD, confirmed that AMD’s upcoming Instinct MI450 GPU accelerator will adopt the world-leading TSMC 2-nanometer (N2) process. This further strengthens the cooperation between AMD and TSMC in the field of advanced process technology and also demonstrates the application prospects of the 2-nanometer process in the high-end GPU field.
Samsung Electronics also has new moves. According to the news on October 10 local time, Samsung has already provided samples of the SM8850s (that is, the Snapdragon 8 Elite Gen 5 based on Samsung’s process) mobile chip to Qualcomm. This means that Samsung has achieved new progress in the mobile chip foundry field and is expected to further expand its share in the semiconductor foundry market.
In addition, Texas Instruments (TI) launched its latest industrial digital micromirror device, the DLP991UUV, on September 30, 2025. It is specially designed for advanced packaging and maskless lithography (LDI) technologies, demonstrating Texas Instruments’ continuous innovation ability in the semiconductor sub-sector.
In terms of process technology layout, Cao Zhiping, Executive Vice President and President of China Region of STMicroelectronics (ST), shared at relevant forums how ST promotes innovation with FD-SOI (Fully Depleted Silicon-On-Insulator) and demonstrated ST’s development strategy for FD-SOI technology. Taejoong Song, Vice President of Samsung Foundry and Head of Technology Planning Department 2, shared the latest developments of Samsung’s FD-SOI technology, stating that its 18FDS+ entered mass production in 2025, further enriching Samsung’s semiconductor technology product line.
Nexperia's Control Crisis Triggers Turmoil in the Global Power Semiconductor Market
View detailsLatest updates on U.S. AI chip export controls, EU nanopore tech breakthrough, and global memory shortage—plus how suppliers like ChipApex ensure component continuity for engineers worldwide.
View detailsSamsung's HBM3E chips have passed NVIDIA's certification, and SK Hynix has completed the development of HBM4 chips.
View detailsRecently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological research and development and market strategies. Malaysia has achie...
View details